Inventor · disambiguated record
Ryu Harada
Also filed as: HARADA RYU
4 granted patents·1 pending application·4 citations·filing 2016–2021
60Inventor score
Top patents by PatentIndex Score
5 records- 0184US10822527B2Thermosetting adhesive composition, thermosetting adhesive film, and composite filmTOMOEGAWA CO LTD·Filed 2016·Granted Nov 3, 2020·3 cites·11 claims
- 0272US10751976B2Resin-clad metal foil and flexible printed wiring boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Aug 25, 2020·1 cites·6 claims
- 0366US11818835B2Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foilPANASONIC IP MAN CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 0450US2018270945A1Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foilPANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 0549US10568201B2Multilayer printed wiring board and multilayer metal clad laminated boardPANASONIC IP MAN CO LTD·Filed 2017·Granted Feb 18, 2020·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →