Inventor · disambiguated record
Ryosuke Hoshino
Also filed as: HOSHINO RYOSUKE
4 granted patents·6 pending applications·0 citations·filing 2021–2025
52Inventor score
Top patents by PatentIndex Score
10 records- 0164US2025182971A1Electronic component, circuit board arrangement, electronic device, and method of manufacturing electronic componentTAIYO YUDEN KK·Filed 2025·Application pending·0 cites
- 0259US11631542B2Electronic component, circuit board arrangement and method of manufacturing electronic componentTAIYO YUDEN KK·Filed 2021·Granted Apr 18, 2023·0 cites·19 claims
- 0356US2024369925A1Resist auxiliary film composition, and pattern forming method using said compositionMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0456US2024369924A1Resist composition and resist film forming method using sameMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0554US2025321485A1Resist auxiliary film composition, and pattern forming method using sameMITSUBISHI GAS CHEMICAL CO·Filed 2023·Application pending·0 cites
- 0654US2025354093A1Thinner composition, and method for producing semiconductor device using thinner compositionMITSUBISHI GAS CHEMICAL CO·Filed 2023·Application pending·0 cites
- 0750US11776756B2Ceramic electronic component, substrate arrangement and method of manufacturing ceramic electronic componentTAIYO YUDEN KK·Filed 2022·Granted Oct 3, 2023·0 cites·19 claims
- 0850US11626247B2Electronic component, circuit board arrangement, and method of manufacturing electronic componentTAIYO YUDEN KK·Filed 2021·Granted Apr 11, 2023·0 cites·17 claims
- 0950US2024361693A1Thinner composition, and method for producing semiconductor devices using said thinner compositionMITSUBISHI GAS CHEMICAL CO·Filed 2022·Application pending·0 cites
- 1048US11482381B2Ceramic electronic component, method of producing the same, and circuit boardTAIYO YUDEN KK·Filed 2021·Granted Oct 25, 2022·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →