Inventor · disambiguated record
Ryuma Kamikomaki
Also filed as: KAMIKOMAKI RYUMA
1 granted patent·2 pending applications·0 citations·filing 2021–2025
14Inventor score
Technology areasH10W
Files withDENSO CORP3
Top patents by PatentIndex Score
3 records- 0172US2025259902A1Semiconductor package, electronic device, and method for manufacturing semiconductor packageDENSO CORP·Filed 2025·Application pending·0 cites
- 0272US2025253198A1Semiconductor package, electronic device, and method for manufacturing semiconductor packageDENSO CORP·Filed 2025·Application pending·0 cites
- 0364US12400923B2Semiconductor package, electronic device, and method for manufacturing semiconductor packageDENSO CORP·Filed 2021·Granted Aug 26, 2025·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →