Inventor · disambiguated record
Ryuichi Kanamura
Also filed as: KANAMURA RYUICHI
24 granted patents·2 pending applications·130 citations·filing 1996–2023
95Inventor score
Top patents by PatentIndex Score
26 records- 0197US10128301B2Semiconductor device, solid-state imaging device and electronic apparatusSONY CORP·Filed 2017·Granted Nov 13, 2018·9 cites·20 claims
- 0297US9570499B2Semiconductor device, solid-state imaging device and electronic apparatusSONY CORP·Filed 2016·Granted Feb 14, 2017·8 cites·26 claims
- 0397US9431450B2Semiconductor device, solid-state imaging device and electronic apparatusSONY CORP·Filed 2013·Granted Aug 30, 2016·12 cites·24 claims
- 0494US10840290B2Semiconductor device, solid-state imaging device and electronic apparatusSONY CORP·Filed 2019·Granted Nov 17, 2020·2 cites·21 claims
- 0593US10475845B2Semiconductor device, solid-state imaging device and electronic apparatusSONY CORP·Filed 2019·Granted Nov 12, 2019·4 cites·20 claims
- 0693US9917131B2Semiconductor device, solid-state imaging device and electronic apparatusSONY CORP·Filed 2017·Granted Mar 13, 2018·5 cites·26 claims
- 0792US10535700B2Semiconductor device, solid-state imaging device and electronic apparatusSONY CORP·Filed 2018·Granted Jan 14, 2020·4 cites·18 claims
- 0890US12408451B2Semiconductor device, solid-state imaging device and electronic apparatusSONY GROUP CORP·Filed 2023·Granted Sep 2, 2025·0 cites·15 claims
- 0987US11374049B2Semiconductor device, solid-state imaging device and electronic apparatusSONY CORP·Filed 2020·Granted Jun 28, 2022·1 cites·20 claims
- 1083US11875989B2Semiconductor device, solid-state imaging device and electronic apparatusSONY GROUP CORP·Filed 2022·Granted Jan 16, 2024·0 cites·20 claims
- 1180US7259089B2Semiconductor device manufacturing method that includes forming a wiring pattern with a mask layer that has a tapered shapeSONY CORP·Filed 2005·Granted Aug 21, 2007·7 cites·12 claims
- 1271US7176120B2Method of manufacturing semiconductor deviceSONY CORP·Filed 2005·Granted Feb 13, 2007·5 cites·22 claims
- 1367US7534721B2Semiconductor device manufacturing deviceSONY CORP·Filed 2007·Granted May 19, 2009·3 cites·5 claims
- 1464US7304386B2Semiconductor device having a multilayer wiring structureSONY CORP·Filed 2005·Granted Dec 4, 2007·7 cites·3 claims
- 1562US6358835B1Method of manufacturing a semiconductor deviceSONY CORP·Filed 2000·Granted Mar 19, 2002·11 cites·6 claims
- 1662US5723362AMethod of forming interconnectionSONY CORP·Filed 1996·Granted Mar 3, 1998·27 cites·8 claims
- 1761US7087563B2Resist stripping composition and method of producing semiconductor device using the sameEKC TECHNOLOGY K K·Filed 2002·Granted Aug 8, 2006·9 cites·11 claims
- 1859US7119007B2Production method of semiconductor deviceSONY CORP·Filed 2005·Granted Oct 10, 2006·1 cites·2 claims
- 1955US7242096B2Semiconductor device and method for manufacturing the sameSONY CORP·Filed 2004·Granted Jul 10, 2007·8 cites·3 claims
- 2054US6946385B2Production method for semiconductor deviceSONY CORP·Filed 2003·Granted Sep 20, 2005·5 cites·11 claims
- 2151US7642655B2Semiconductor device and method of manufacture thereofSONY CORP·Filed 2005·Granted Jan 5, 2010·0 cites·1 claims
- 2251US6856018B2Semiconductor device and method of manufacture thereofSONY CORP·Filed 2001·Granted Feb 15, 2005·2 cites·1 claims
- 2343US7319271B2Semiconductor deviceSONY CORP·Filed 2006·Granted Jan 15, 2008·0 cites·4 claims
- 2443US6989330B2Semiconductor device and method of manufacture thereofSONY CORP·Filed 2004·Granted Jan 24, 2006·0 cites·2 claims
- 2541US2006163739A1Semiconductor device and method for production thereofKOMAI NAOKI·Filed 2005·Application pending·0 cites
- 2639US2006166482A1Semiconductor device manufacturing deviceKANAMURA RYUICHI·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →