Inventor · disambiguated record
Ryohei Kasai
Also filed as: KASAI RYOHEI
4 granted patents·2 pending applications·1 citations·filing 2016–2024
59Inventor score
Top patents by PatentIndex Score
6 records- 0171US2025031315A1Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring boardDAINIPPON PRINTING CO LTD·Filed 2024·Application pending·0 cites
- 0264US12144120B2Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring boardDAINIPPON PRINTING CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·6 claims
- 0359US11191164B2Wiring structure and method of manufacturing the same, semiconductor device, multilayer wiring structure and method of manufacturing the same, semiconductor element mounting substrate, method of forming pattern structure, imprint mold and method of manufacturing the same, imprint mold set, and method of manufacturing multilayer wiring boardDAINIPPON PRINTING CO LTD·Filed 2016·Granted Nov 30, 2021·1 cites·12 claims
- 0456US10672722B2Mounting component and electronic deviceDAINIPPON PRINTING CO LTD·Filed 2019·Granted Jun 2, 2020·0 cites·17 claims
- 0550US2023246006A1Joint structureTDK CORP·Filed 2023·Application pending·0 cites
- 0649US10276515B2Mounting component, wiring substrate, electronic device and manufacturing method thereofDAINIPPON PRINTING CO LTD·Filed 2018·Granted Apr 30, 2019·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →