Inventor · disambiguated record
Ryohei Kitada
Also filed as: KITADA RYOHEI
5 granted patents·1 citations·filing 2012–2021
68Inventor score
Top patents by PatentIndex Score
5 records- 0172US11817427B2Semiconductor device having through silicon vias and manufacturing method thereofLONGITUDE LICENSING LTD·Filed 2021·Granted Nov 14, 2023·0 cites·16 claims
- 0268US11211363B2Semiconductor device having through silicon vias and manufacturing method thereofLONGITUDE LICENSING LTD·Filed 2020·Granted Dec 28, 2021·0 cites·9 claims
- 0368US10497676B2Semiconductor device having through silicon vias and manufacturing method thereofLONGITUDE SEMICONDUCTOR SARL·Filed 2016·Granted Dec 3, 2019·1 cites·24 claims
- 0461US10651158B2Method of forming a semiconductor device having through silicon viasLONGITUDE LICENSING LTD·Filed 2019·Granted May 12, 2020·0 cites·16 claims
- 0544US9515037B2Semiconductor device having through silicon vias and manufacturing method thereofKITADA RYOHEI·Filed 2012·Granted Dec 6, 2016·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →