Inventor · disambiguated record
Ryota Mae
Also filed as: MAE RYOTA
3 granted patents·15 pending applications·1 citations·filing 2020–2025
48Inventor score
Files withFUJIMI INC18
Top patents by PatentIndex Score
18 records- 0181US11884843B2Polishing composition, polishing method, and method of producing semiconductor substrateFUJIMI INC·Filed 2022·Granted Jan 30, 2024·1 cites·16 claims
- 0266US2024218208A1Polishing composition, polishing method, and method for producing semiconductor substrateFUJIMI INC·Filed 2023·Application pending·0 cites
- 0360US2024101866A1Polishing composition, production method of polishing composition, polishing method, and manufacturing method of semiconductor substrateFUJIMI INC·Filed 2023·Application pending·0 cites
- 0458US2024309240A1Polishing composition, polishing method, and method for producing semiconductor substrateFUJIMI INC·Filed 2024·Application pending·0 cites
- 0555US2023312981A1Method for producing inorganic particle-containing slurry and zirconia particle-containing slurryFUJIMI INC·Filed 2023·Application pending·0 cites
- 0654US2025304829A1Method for producing polishing composition and method for producing rinse compositionFUJIMI INC·Filed 2025·Application pending·0 cites
- 0753US11814294B2Method of producing anionically modified colloidal silicaFUJIMI INC·Filed 2021·Granted Nov 14, 2023·0 cites·2 claims
- 0851US11702570B2Polishing compositionFUJIMI INC·Filed 2020·Granted Jul 18, 2023·0 cites·23 claims
- 0951US2021292599A1Polishing composition, polishing method, and method of producing semiconductor substrateFUJIMI INC·Filed 2021·Application pending·0 cites
- 1050US2024318036A1Polishing composition, polishing method and method for producing semiconductor substrateFUJIMI INC·Filed 2024·Application pending·0 cites
- 1147US2025320381A1Polishing composition, polishing method, and method for manufacturing semiconductor substrateFUJIMI INC·Filed 2025·Application pending·0 cites
- 1246US2024327674A1Polishing composition, polishing method, and method for producing semiconductor substrateFUJIMI INC·Filed 2024·Application pending·0 cites
- 1344US2023090620A1Polishing composition, polishing method, and method for producing semiconductor substrateFUJIMI INC·Filed 2022·Application pending·0 cites
- 1444US2024343943A1Polishing composition, polishing composition production method, polishing method, and semiconductor substrate production methodFUJIMI INC·Filed 2022·Application pending·0 cites
- 1544US2025282977A1Polishing composition, polishing method, and method for manufacturing semiconductor substrateFUJIMI INC·Filed 2025·Application pending·0 cites
- 1642US2022306900A1Polishing composition, polishing method and method for producing semiconductor substrateFUJIMI INC·Filed 2022·Application pending·0 cites
- 1742US2022306901A1Polishing composition, polishing method and method for producing semiconductor substrateFUJIMI INC·Filed 2022·Application pending·0 cites
- 1840US2021079264A1Polishing composition, method for producing polishing composition, polishing method, and method for producing semiconductor substrateFUJIMI INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →