Inventor · disambiguated record
Ryota Mita
Also filed as: MITA RYOTA
10 granted patents·17 pending applications·13 citations·filing 2000–2025
80Inventor score
Top patents by PatentIndex Score
27 records- 0182US11948907B2LaminateNITTO DENKO CORP·Filed 2021·Granted Apr 2, 2024·1 cites·6 claims
- 0267US11676936B2Manufacturing method for semiconductor deviceNITTO DENKO CORP·Filed 2019·Granted Jun 13, 2023·1 cites·18 claims
- 0367US11594513B2Manufacturing method for semiconductor deviceNITTO DENKO CORP·Filed 2019·Granted Feb 28, 2023·1 cites·6 claims
- 0463US7197149B1Cellular phoneHITACHI LTD·Filed 2000·Granted Mar 27, 2007·10 cites·14 claims
- 0560US2024421010A1Sinter bonding sheet rollNITTO DENKO CORP·Filed 2024·Application pending·0 cites
- 0659US2024413116A1Sinter bonding sheetNITTO DENKO CORP·Filed 2024·Application pending·0 cites
- 0758US12441305B2Vehicle control deviceHITACHI ASTEMO LTD·Filed 2021·Granted Oct 14, 2025·0 cites·6 claims
- 0858US2024339335A1Sinter bonding sheetNITTO DENKO CORP·Filed 2024·Application pending·0 cites
- 0956US11898850B2Vehicle position detection device and parameter set creation device for vehicle position detectionHITACHI ASTEMO LTD·Filed 2020·Granted Feb 13, 2024·0 cites·6 claims
- 1053US11697567B2Wound body of sheet for sintering bonding with base materialNITTO DENKO CORP·Filed 2020·Granted Jul 11, 2023·0 cites·8 claims
- 1151US2016176160A1Release sheet and release sheet-including silicone resin sheetNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 1250US2025256739A1Signal processing deviceHITACHI ASTEMO LTD·Filed 2022·Application pending·0 cites
- 1348US11352527B2Sinter-bonding composition, sinter-bonding sheet and dicing tape with sinter-bonding sheetNITTO DENKO CORP·Filed 2018·Granted Jun 7, 2022·0 cites·8 claims
- 1448US2014178678A1Encapsulating sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1547US11839936B2Sheet for sintering bonding and sheet for sintering bonding with base materialNITTO DENKO CORP·Filed 2020·Granted Dec 12, 2023·0 cites·20 claims
- 1647US2005105714A1Communication terminal apparatus and reproducing methodFiled 2004·Application pending·0 cites
- 1745US2021139746A1Thermosetting sheet and dicing die bonding filmNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 1845US2021139745A1Thermosetting sheet and dicing die bonding filmNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 1944US11456215B2Manufacturing method for semiconductor deviceNITTO DENKO CORP·Filed 2019·Granted Sep 27, 2022·0 cites·10 claims
- 2044US2020294952A1Sheet for sintering bonding, sheet for sintering bonding with base material, and semiconductor chip with layer of material for sintering bondingNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 2144US2020294951A1Sheet for sintering bonding and sheet for sintering bonding with base materialNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 2244US2020294961A1Sheet for sintering bonding and sheet for sintering bonding with base materialNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 2344US2022230989A1Semiconductor device and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 2443US2025262691A1Thermal bonding sheet, and dicing tape-equipped thermal bonding sheetNITTO DENKO CORP·Filed 2025·Application pending·0 cites
- 2539US2002082059A1Portable mobile unitHITACHI LTD·Filed 2001·Application pending·0 cites
- 2638US2021174984A1Sinter-bonding composition, sinter-bonding sheet and dicing tape with sinter-bonding sheetNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 2733US2017152357A1Encapsulating sheet, production method thereof, optical semiconductor device and encapsulated optical semiconductor elementNITTO DENKO CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →