Inventor · disambiguated record
Ryo Mori
Also filed as: MORI RYO
24 granted patents·9 pending applications·290 citations·filing 1994–2021
96Inventor score
Files withRENESAS ELECTRONICS CORP11FUJIFILM CORP6RENESAS TECH CORP6SASAKI TOSHIO4FUJI PHOTO FILM CO LTD3
Top patents by PatentIndex Score
33 records- 0197US8379425B2Semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Feb 19, 2013·60 cites·14 claims
- 0296US7534989B2Detecting device and laminated body manufacturing apparatus employing such detecting deviceFUJIFILM CORP·Filed 2005·Granted May 19, 2009·63 cites·20 claims
- 0390US7714606B2Semiconductor integrated circuitRENESAS TECH CORP·Filed 2006·Granted May 11, 2010·20 cites·30 claims
- 0490US7623364B2Semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Nov 24, 2009·16 cites·23 claims
- 0588US7872891B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Jan 18, 2011·13 cites·27 claims
- 0685US8896129B2Semiconductor device and manufacturing method for the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Nov 25, 2014·5 cites·15 claims
- 0785US7245521B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2005·Granted Jul 17, 2007·17 cites·7 claims
- 0883US5659491AMethod and system for inspecting an assembly, and electrical inspection apparatus for a flash unitFUJI PHOTO FILM CO LTD·Filed 1994·Granted Aug 19, 1997·26 cites·15 claims
- 0982US6343185B1Lens cleaning apparatus and method and recycling apparatus and method for lens-fitted photo film unitFUJI PHOTO FILM CO LTD·Filed 1999·Granted Jan 29, 2002·21 cites·40 claims
- 1081US7486544B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2007·Granted Feb 3, 2009·12 cites·10 claims
- 1180US9171767B2Semiconductor device and manufacturing method for the sameRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 27, 2015·3 cites·15 claims
- 1280US8253481B2Semiconductor integrated circuit deviceSASAKI TOSHIO·Filed 2011·Granted Aug 28, 2012·5 cites·16 claims
- 1380US8044709B2Semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Oct 25, 2011·6 cites·24 claims
- 1478US10199085B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Feb 5, 2019·3 cites·23 claims
- 1574US8421527B2Semiconductor integrated circuit deviceSASAKI TOSHIO·Filed 2012·Granted Apr 16, 2013·3 cites·4 claims
- 1671US10782763B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Sep 22, 2020·1 cites·8 claims
- 1767US10222847B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Mar 5, 2019·1 cites·7 claims
- 1867US8730703B2Semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted May 20, 2014·2 cites·10 claims
- 1967US7652333B2Semiconductor integrated circuitRENESAS TECH CORP·Filed 2006·Granted Jan 26, 2010·3 cites·20 claims
- 2062US8400806B2Semiconductor deviceSASAKI TOSHIO·Filed 2010·Granted Mar 19, 2013·1 cites·20 claims
- 2160US6575338B2Fluid dispenser and lens inspection deviceFUJI PHOTO FILM CO LTD·Filed 2001·Granted Jun 10, 2003·8 cites·13 claims
- 2253US7221446B2Fluid dispenser and lens inspection deviceFUJIFILM CORP·Filed 2005·Granted May 22, 2007·0 cites·3 claims
- 2351US11675404B2Semiconductor device including power failure detection circuitRENESAS ELECTRONICS CORP·Filed 2021·Granted Jun 13, 2023·0 cites·8 claims
- 2451US2010090282A1Semiconductor integrated circuitRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 2550US2009050261A1Apparatus for and Method of Manufacturing Photosensitive Laminated BodyFUJIFILM CORP·Filed 2006·Application pending·0 cites
- 2650US2016027731A1Semiconductor device and manufacturing method for the sameRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 2750US2009078365A1Apparatus for and method of manufacturing photosensitive laminated bodyFUJIFILM CORP·Filed 2006·Application pending·0 cites
- 2849US2008190543A1Apparatus For and Method of Manufacturing Photosensitive Laminated BodFUJIFILM CORP·Filed 2005·Application pending·0 cites
- 2944US7027144B2Fluid dispenser and lens inspection deviceMORITA MASAYA·Filed 2003·Granted Apr 11, 2006·1 cites·2 claims
- 3039US2004100708A1Producing method of optical filmFiled 2003·Application pending·0 cites
- 3138US2008115879A1Method of Manufacturing Photosensitive Laminated Body and Apparatus ThereforFUJIFILM CORP·Filed 2005·Application pending·0 cites
- 3237US2009079465A1Semiconductor integrated circuitSASAKI TOSHIO·Filed 2005·Application pending·0 cites
- 3337US2020286583A1Copy number measurement device, computer readable medium, copy number measurement method and gene panelMITSUBISHI SPACE SOFTWARE CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →