Inventor · disambiguated record
Ryoji Murai
Also filed as: MURAI Ryoji
6 granted patents·4 pending applications·2 citations·filing 2014–2022
67Inventor score
Files withMITSUBISHI ELECTRIC CORP10
Top patents by PatentIndex Score
10 records- 0163US10964622B2Semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Mar 30, 2021·1 cites·11 claims
- 0258US10049960B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Aug 14, 2018·1 cites·17 claims
- 0349US2025167079A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0448US2025359283A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0544US2023141875A1Cooler and semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 0639US11270929B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Mar 8, 2022·0 cites·15 claims
- 0739US2023178454A1Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 0835US11063004B2Semiconductor device, control device, and method for manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 13, 2021·0 cites·23 claims
- 0934US10714404B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jul 14, 2020·0 cites·13 claims
- 1033US10682792B2Mold deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jun 16, 2020·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →