Inventor · disambiguated record
Ryuichi Murayama
Also filed as: MURAYAMA RYUICHI
5 granted patents·4 pending applications·7 citations·filing 2001–2016
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0152US8754178B2Resin composition and semiconductor device produced using resin compositionKAWANA TAKASHI·Filed 2011·Granted Jun 17, 2014·2 cites·3 claims
- 0245US6861013B2Die-attaching paste and semiconductor deviceSUMITOMO BAKELITE CO·Filed 2001·Granted Mar 1, 2005·5 cites·9 claims
- 0330US2014183715A1Semiconductor deviceKANAMORI NAOYA·Filed 2012·Application pending·0 cites
- 0429US2018194869A1Thermally conductive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsinkSUMITOMO BAKELITE CO·Filed 2016·Application pending·0 cites
- 0526US2014341242A1Resin composition, semiconductor device using same, and method of manufacturing semiconductor deviceMURAYAMA RYUICHI·Filed 2012·Application pending·0 cites
- 0625US10259976B2Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsinkSUMITOMO BAKELITE CO·Filed 2016·Granted Apr 16, 2019·0 cites·21 claims
- 0725US9379051B2Semiconductor deviceSHIMOBE YASUO·Filed 2012·Granted Jun 28, 2016·0 cites·10 claims
- 0825US8722768B2Liquid resin composition and semiconductor deviceMAKIHARA KOUJI·Filed 2011·Granted May 13, 2014·0 cites·5 claims
- 0921US2013289166A1Resin composition and semiconductor deviceMAKIHARA KOUJI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →