Inventor · disambiguated record
Ryuichi Oikawa
Also filed as: OIKAWA RYUICHI
30 granted patents·6 pending applications·153 citations·filing 1996–2024
95Inventor score
Top patents by PatentIndex Score
36 records- 0192US9917026B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Mar 13, 2018·13 cites·20 claims
- 0291US7378745B2Package substrate for a semiconductor device having thermoplastic resin layers and conductive patternsNEC ELECTRONICS CORP·Filed 2005·Granted May 27, 2008·39 cites·21 claims
- 0388US11749597B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2020·Granted Sep 5, 2023·2 cites·8 claims
- 0485US5675160ASemiconductor memory device having an internal amplification functionNEC CORP·Filed 1996·Granted Oct 7, 1997·55 cites·3 claims
- 0579US10809470B2Electronic device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2019·Granted Oct 20, 2020·2 cites·18 claims
- 0679US9035450B2Semiconductor device and interconnect substrateRENESAS ELECTRONICS CORP·Filed 2014·Granted May 19, 2015·4 cites·20 claims
- 0778US10090881B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Oct 2, 2018·2 cites·5 claims
- 0878US9006910B2Interconnection structureOIKAWA RYUICHI·Filed 2011·Granted Apr 14, 2015·6 cites·15 claims
- 0973US9312216B2Semiconductor device with semiconductor chip and wiring layersRENESAS ELECTRONICS CORP·Filed 2015·Granted Apr 12, 2016·2 cites·18 claims
- 1068US10347552B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 9, 2019·1 cites·13 claims
- 1167US11171112B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Nov 9, 2021·1 cites·16 claims
- 1267US9560762B2Semiconductor device and circuit boardRENESAS ELECTRONICS CORP·Filed 2013·Granted Jan 31, 2017·2 cites·20 claims
- 1367US7292054B2Impedance measuring apparatus of package substrate and method for the sameNEC ELECTRONICS CORP·Filed 2006·Granted Nov 6, 2007·5 cites·19 claims
- 1466US6351000B1Semiconductor having a heterojunction formed between a plurality of semiconductor layersNEC CORP·Filed 2000·Granted Feb 26, 2002·12 cites·15 claims
- 1564US2025218918A1Electronic deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1663US11431378B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Aug 30, 2022·0 cites·5 claims
- 1763US2025029933A1Electronic deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1860US8253421B2Impedance measurement method and impedance measurement deviceOIKAWA RYUICHI·Filed 2010·Granted Aug 28, 2012·1 cites·15 claims
- 1958US12165995B2Designing method and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2022·Granted Dec 10, 2024·0 cites·13 claims
- 2056US12199053B2Electronic device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2022·Granted Jan 14, 2025·0 cites·20 claims
- 2154US2018367186A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 2252US12009309B2Semiconductor device having a plurality of semiconductor layers covering an emission layerRENESAS ELECTRONICS CORP·Filed 2021·Granted Jun 11, 2024·0 cites·17 claims
- 2351US11437341B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2020·Granted Sep 6, 2022·0 cites·6 claims
- 2450US11171083B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Nov 9, 2021·0 cites·20 claims
- 2548US11177235B2Semiconductor device with improved signal transmission characteristicsRENESAS ELECTRONICS CORP·Filed 2019·Granted Nov 16, 2021·0 cites·15 claims
- 2648US9620447B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Granted Apr 11, 2017·0 cites·11 claims
- 2746US8104013B2Design method of semiconductor package substrate to cancel a reflected waveOIKAWA RYUICHI·Filed 2009·Granted Jan 24, 2012·0 cites·16 claims
- 2845US2015123258A1Semiconductor device and interconnect substrateRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 2942US10403569B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Sep 3, 2019·0 cites·11 claims
- 3040US8373263B2Interconnection structure and its design methodRENESAS ELECTRONICS CORP·Filed 2011·Granted Feb 12, 2013·0 cites·9 claims
- 3138US10027311B1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Jul 17, 2018·0 cites·13 claims
- 3238US2011133340A1Package substrate and semiconductor apparatusRENESAS ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 3336US2017263693A1Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 3435US5942778ASwitching transistor and capacitor for memory cellNEC CORP·Filed 1997·Granted Aug 24, 1999·5 cites·9 claims
- 3533US9461016B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Oct 4, 2016·0 cites·15 claims
- 3631US5942764ASemiconductor memory device and method of reading data in semiconductor memory deviceNEC CORP·Filed 1997·Granted Aug 24, 1999·1 cites·37 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →