Inventor · disambiguated record
Ryuichi Sahara
Also filed as: SAHARA RYUICHI
14 granted patents·4 pending applications·514 citations·filing 1998–2009
95Inventor score
Top patents by PatentIndex Score
18 records- 0197US7495319B2Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the samePANASONIC CORP·Filed 2005·Granted Feb 24, 2009·59 cites·11 claims
- 0293US7279357B2Method for fabricating a chip-scale-packaging (CSP) having an inductorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Oct 9, 2007·30 cites·18 claims
- 0391US6852616B2Semiconductor device and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 8, 2005·72 cites·10 claims
- 0490US6914331B2Semiconductor device having an inductor formed on a region of an insulating filmMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jul 5, 2005·55 cites·8 claims
- 0590US6559528B2Semiconductor device and method for the fabrication thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 6, 2003·59 cites·6 claims
- 0688US6313532B1Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Nov 6, 2001·74 cites·8 claims
- 0785US6512298B2Semiconductor device and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 28, 2003·40 cites·14 claims
- 0884US6713880B2Semiconductor device and method for producing the same, and method for mounting semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 30, 2004·32 cites·12 claims
- 0984US6680220B2Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor packageMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 20, 2004·32 cites·6 claims
- 1077US6812573B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Nov 2, 2004·18 cites·15 claims
- 1173US6680524B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 20, 2004·20 cites·5 claims
- 1272US6784557B2Semiconductor device including a diffusion layer formed between electrode portionsMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 31, 2004·16 cites·8 claims
- 1351US6924173B2Semiconductor device and method for the fabrication thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 2, 2005·4 cites·7 claims
- 1450US2009130801A1Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the samePANASONIC CORP·Filed 2009·Application pending·0 cites
- 1549US6954001B2Semiconductor device including a diffusion layerMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Oct 11, 2005·3 cites·18 claims
- 1642US2005006749A1Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 1739US2002000655A1Semiconductor device and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 1838US2002052056A1Semiconductor device and method for fabricating the sameFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →