Inventor · disambiguated record
Ryuji Takahashi
Also filed as: TAKAHASHI RYUJI
19 granted patents·7 pending applications·170 citations·filing 1975–2025
93Inventor score
Files withPANASONIC IP MAN CO LTD6SHOWA DENKO KK6FUNAI ELECTRIC CO3SHINKO ELECTRIC IND CO2TOSHIBA KK2
Top patents by PatentIndex Score
26 records- 0189US6917392B2Liquid crystal display apparatus of a lateral direction electric field drive typeNEC LCD TECHNOLOGIES LTD·Filed 2000·Granted Jul 12, 2005·45 cites·8 claims
- 0284US3989649AProcess for production of spherical porous fillers for liquid chromatography by suspension polymerization of monovinyl and polyvinyl aromatic monomers in the presence of paraffin waxSHOWA DENKO KK·Filed 1975·Granted Nov 2, 1976·42 cites·15 claims
- 0374US6517254B1Collar member and ferruleSEIKO INSTR INC·Filed 2001·Granted Feb 11, 2003·21 cites·31 claims
- 0473US7755705B2Television receiver with multiple voice outputsFUNAI ELECTRIC CO·Filed 2006·Granted Jul 13, 2010·4 cites·11 claims
- 0566US7550436B2Compositions containing peptide and electrolyte excretion promoter and foods containing the sameKRACIE PHARMA LTD·Filed 2001·Granted Jun 23, 2009·6 cites·6 claims
- 0664US6759442B2Packing material for solid phase extraction and solid phase extraction methodSHOWA DENKO KK·Filed 2001·Granted Jul 6, 2004·6 cites·19 claims
- 0764US4484443AControl system for superhigh pressure generation circuitSUMITOMO METAL IND·Filed 1981·Granted Nov 27, 1984·11 cites·10 claims
- 0863US6602928B2Packing material and cartridge for solid phase extractionSHOWA DENKO KK·Filed 2001·Granted Aug 5, 2003·8 cites·15 claims
- 0962US6650497B1Recording and/or reproducing apparatus and method for loading a head on a disc-shaped recording mediumSONY CORP·Filed 2000·Granted Nov 18, 2003·5 cites·27 claims
- 1061US11869797B2Electrostatic chuck and method of manufacturing electrostatic chuckSHINKO ELECTRIC IND CO·Filed 2022·Granted Jan 9, 2024·0 cites·8 claims
- 1161US2025290987A1Information processing apparatus and impedance estimation methodTOSHIBA KK·Filed 2025·Application pending·0 cites
- 1258US6362245B1Porous co-polymer particles, process for preparing the same and use of the sameSHOWA DENKO KK·Filed 1999·Granted Mar 26, 2002·20 cites·23 claims
- 1357US2022356349A1Resin composition, prepreg obtained using same, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring boardPANASONIC IP MAN CO LTD·Filed 2020·Application pending·0 cites
- 1451US12021015B2Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2019·Granted Jun 25, 2024·0 cites·7 claims
- 1551US11456200B2Substrate fixing apparatus including a base plate, an electrostatic adsorption member, a plurality of support members on the base plate and supporting the electrostatic adsorption member, and an adhesive layer bonding the electrostatic adsorption member to the base plateSHINKO ELECTRIC IND CO·Filed 2020·Granted Sep 27, 2022·0 cites·10 claims
- 1651US2025062966A1Information processing apparatus, information processing method, and computer program productTOSHIBA KK·Filed 2024·Application pending·0 cites
- 1748US7564743B2Optical disc apparatusFUNAI ELECTRIC CO·Filed 2006·Granted Jul 21, 2009·0 cites·4 claims
- 1846US2005162554A1Disk device integral type television receiver set and reproducing apparatus integral type television receiver setFUNAI ELECTRIC CO·Filed 2004·Application pending·0 cites
- 1945US11414528B2Thermosetting resin composition, prepreg, metal-clad laminate, printed wiring board, film with resin, and metal foil with resinPANASONIC IP MAN CO LTD·Filed 2018·Granted Aug 16, 2022·0 cites·11 claims
- 2045US11247192B2Packing material for HILIC columns, HILIC column filled with same, and method for analyzing oligosaccharide with use of sameSHOWA DENKO KK·Filed 2017·Granted Feb 15, 2022·0 cites·7 claims
- 2144US12003236B2Semiconductor deviceKIOXIA CORP·Filed 2022·Granted Jun 4, 2024·0 cites·10 claims
- 2240US10472478B2Prepreg, metal-clad laminate and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2016·Granted Nov 12, 2019·0 cites·5 claims
- 2340US8062750B2Epoxy resin composition for prepreg, prepreg and multilayered printed wiring boardMOTOBE HIDETSUGU·Filed 2004·Granted Nov 22, 2011·2 cites·14 claims
- 2440US2016293538A1Thermosetting resin composition, metal-clad laminated plate, insulating sheet, printed wiring board, method of manufacturing printed wiring board, and package substratePANASONIC IP MAN CO LTD·Filed 2016·Application pending·0 cites
- 2536US2002155090A1Hydrophilic separating carrier particle and process for producing the sameSHOWA DENKO KK·Filed 2002·Application pending·0 cites
- 2634US2022025171A1Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →