Inventor · disambiguated record
Ryuichi Takano
Also filed as: TAKANO RYUICHI
9 granted patents·1 pending application·665 citations·filing 1991–2022
90Inventor score
Top patents by PatentIndex Score
10 records- 0197US6067062ALight valve deviceSEIKO INSTR INC·Filed 1991·Granted May 23, 2000·199 cites·42 claims
- 0297US5637187ALight valve device makingSEIKO INSTR INC·Filed 1995·Granted Jun 10, 1997·204 cites·16 claims
- 0393US5646432ASemiconductor thin film formed on a supporting substrateSEIKO INSTR INC·Filed 1993·Granted Jul 8, 1997·205 cites·49 claims
- 0484US7629231B2Fabrication method of semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Dec 8, 2009·13 cites·8 claims
- 0583US8703583B2Fabrication method of semiconductor deviceMAKI HIROSHI·Filed 2009·Granted Apr 22, 2014·12 cites·21 claims
- 0662US5459335ASemiconductor substrate having a thin film semiconductor layer bonded on a support substrate through an adhesive layerSEIKO INSTR INC·Filed 1993·Granted Oct 17, 1995·31 cites·18 claims
- 0758US12493282B2Information processing apparatus, flow generation method, and computer program productTAZUKE TOMOYUKI·Filed 2022·Granted Dec 9, 2025·0 cites·18 claims
- 0855US8783319B2Foreign substance removing device and die bonder equipped with the sameYAMAGAMI TAKASHI·Filed 2011·Granted Jul 22, 2014·1 cites·4 claims
- 0948US2023056860A1Information processing apparatus, flow generation method, and computer program productTAZUKE TOMOYUKI·Filed 2022·Application pending·0 cites
- 1037US9362250B2Die bonder and bonding methodFASFORD TECHNOLOGY CO LTD·Filed 2013·Granted Jun 7, 2016·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →