Inventor · disambiguated record
Ryutaro Tanaka
Also filed as: TANAKA RYUTARO
6 granted patents·17 pending applications·15 citations·filing 2004–2022
73Inventor score
Top patents by PatentIndex Score
23 records- 0182US8080319B2Thermosetting resin composition and use thereofTANAKA RYUTARO·Filed 2006·Granted Dec 20, 2011·8 cites·17 claims
- 0264US2025109249A1Polyimide Resin, Resin Composition Containing Said Polyimide Resin, and Cured Product ThereofNIPPON KAYAKU KK·Filed 2022·Application pending·0 cites
- 0363US7374862B2Photosensitive resin composition and curing product thereofNIPPON KAYAKU KK·Filed 2004·Granted May 20, 2008·7 cites·22 claims
- 0461US2024343865A1Polyimide Resin, Resin Composition Comprising Polyimide Resin and Cured Product ThereofNIPPON KAYAKU KK·Filed 2022·Application pending·0 cites
- 0558US2023331915A1Isocyanate-Modified Polyimide Resin, Resin Composition and Cured Product of SameNIPPON KAYAKU KK·Filed 2021·Application pending·0 cites
- 0656US12247104B2Polyamic acid resin, polyimide resin, and resin composition including theseNIPPON KAYAKU KK·Filed 2020·Granted Mar 11, 2025·0 cites·11 claims
- 0753US2010096169A1Polyamide Resin as Well as Epoxy Resin Composition Using the Same and Use ThereofNIPPON KAYAKU KK·Filed 2007·Application pending·0 cites
- 0852US2010035182A1Photosensitive resin compositionNIPPON KAYAKU KK·Filed 2008·Application pending·0 cites
- 0952US2025270372A1Bismaleimide compound, resin composition including same, cured object therefrom, semiconductor element and dry film resistNIPPON KAYAKU KK·Filed 2022·Application pending·0 cites
- 1049US2010129604A1Copper foil with resin layerUCHIDA MAKOTO·Filed 2008·Application pending·0 cites
- 1149US2009202793A1Photosensitive, Aqueous Alkaline Solution-Soluble Polyimide Resin and Photosensitive Resin Composition Containing the sameNIPPON KAYAKU KK·Filed 2007·Application pending·0 cites
- 1248US7884172B2Tetraglycidyl ether of 1,1,2,2-tetrakis(hydroxyphenyl)ethaneNIPPON KAYAKU KK·Filed 2006·Granted Feb 8, 2011·0 cites·6 claims
- 1346US7781147B2Imide-urethane resin, photosensitive resin composition including the same and cured productNIPPON KAYAKU KK·Filed 2006·Granted Aug 24, 2010·0 cites·12 claims
- 1445US2009012203A1Epoxy Resin and Epoxy Resin CompositionNIPPON KAYAKU KK·Filed 2006·Application pending·0 cites
- 1541US2008021173A1Epoxy Resin, Epoxy Resin Composition And Cured Product ThereofNAKANISHI MASATAKA·Filed 2005·Application pending·0 cites
- 1640US2012288725A1Heat-Resistant AdhesiveTANAKA RYUTARO·Filed 2011·Application pending·0 cites
- 1740US2010233476A1Copper foil with primer resin layer and laminated sheet using the sameUCHIDA MAKOTO·Filed 2007·Application pending·0 cites
- 1837US8410620B2Primer resin for semiconductor device and semiconductor deviceUCHIDA MAKOTO·Filed 2008·Granted Apr 2, 2013·0 cites·8 claims
- 1937US2007161100A1Photosensitive resin composition and cured product thereofNIPPON KAYAKU KK·Filed 2005·Application pending·0 cites
- 2036US2009042126A1Photosensitive resin composition and cured article thereofTANAKA RYUTARO·Filed 2006·Application pending·0 cites
- 2134US2008146692A1Unsaturated Group-Containing Polyimide Resin, Photosensitive Resin Composition Containing Same, And Cured Product ThereofUEHARA RYUJI·Filed 2005·Application pending·0 cites
- 2231US2008306180A1Polyamide Acid Resin Containing Unsaturated Group, Photosensitive Resin Composition Using Same, and Cured Product ThereofAMISHIMA CHIKA·Filed 2004·Application pending·0 cites
- 2327US2008286688A1Photosensitive Resin Composition and Cured Product ThereofKOYANAGI HIROO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →