Inventor · disambiguated record
Ryujiro Udo
Also filed as: UDO RYUJIRO
7 granted patents·12 pending applications·89 citations·filing 2002–2008
85Inventor score
Top patents by PatentIndex Score
19 records- 0191US6664738B2Plasma processing apparatusHITACHI LTD·Filed 2002·Granted Dec 16, 2003·52 cites·16 claims
- 0284US8426766B2Welding method and welding apparatus for an impellerTSUKAMOTO TAKESHI·Filed 2008·Granted Apr 23, 2013·11 cites·10 claims
- 0369US6838833B2Plasma processing apparatusHITACHI LTD·Filed 2003·Granted Jan 4, 2005·10 cites·6 claims
- 0460US8408873B2Welding slot sealing structure and welding methodIWASA MASAAKI·Filed 2008·Granted Apr 2, 2013·9 cites·4 claims
- 0554US2008121344A1Plasma processing apparatusARAMAKI TOORU·Filed 2008·Application pending·0 cites
- 0653US2008053958A1Plasma processing apparatusKADOTANI MASANORI·Filed 2007·Application pending·0 cites
- 0752US6897403B2Plasma processing method and plasma processing apparatusHITACHI HIGH TECH CORP·Filed 2003·Granted May 24, 2005·3 cites·3 claims
- 0851US7303998B2Plasma processing methodHITACHI HIGH TECH CORP·Filed 2004·Granted Dec 4, 2007·2 cites·10 claims
- 0951US2008017107A1Plasma processing apparatusARAI MASATSUGU·Filed 2007·Application pending·0 cites
- 1048US2007240825A1Wafer processing apparatus capable of controlling wafer temperatureKANNO SEIICHIRO·Filed 2007·Application pending·0 cites
- 1147US2006121195A1Plasma processing apparatus and method for manufacturing electrostatic chuckUDO RYUJIRO·Filed 2006·Application pending·0 cites
- 1244US6812725B2Semiconductor processing apparatus and wafer sensor moduleHITACHI LTD·Filed 2002·Granted Nov 2, 2004·2 cites·18 claims
- 1342US2004178177A1Plasma processing apparatusFiled 2004·Application pending·0 cites
- 1442US2005045104A1Plasma processing apparatusFiled 2004·Application pending·0 cites
- 1542US2005051098A1Plasma processing apparatusFiled 2003·Application pending·0 cites
- 1641US2004163601A1Plasma processing apparatusFiled 2003·Application pending·0 cites
- 1740US2004173469A1Plasma processing apparatus and method for manufacturing electrostatic chuckFiled 2003·Application pending·0 cites
- 1840US2006042757A1Wafer processing apparatus capable of controlling wafer temperatureKANNO SEIICHIRO·Filed 2004·Application pending·0 cites
- 1937US2004040663A1Plasma processing apparatusFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →