Inventor · disambiguated record
Ryota Yamamoto
Also filed as: YAMAMOTO RYOTA
20 granted patents·10 pending applications·125 citations·filing 2003–2025
94Inventor score
Files withNEC ELECTRONICS CORP18MITSUBISHI PLASTICS INC3NICHIA CORP2RENESAS ELECTRONICS CORP2AKAIKE OSAMU1
Top patents by PatentIndex Score
30 records- 0187US11710294B2Apparatus for estimating road parameterDENSO CORP·Filed 2021·Granted Jul 25, 2023·2 cites·12 claims
- 0281US6879234B2Semiconductor integrated circuitNEC ELECTRONICS CORP·Filed 2003·Granted Apr 12, 2005·29 cites·9 claims
- 0377US9650546B2Double-sided adhesive sheet for image display device, double-sided adhesive sheet with release film for image display device, and image display device using sameMITSUBISHI PLASTICS INC·Filed 2013·Granted May 16, 2017·2 cites·14 claims
- 0476US7663207B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2006·Granted Feb 16, 2010·7 cites·20 claims
- 0576US2025287732A1Light emitting element manufacturing method and light emitting elementNICHIA CORP·Filed 2025·Application pending·0 cites
- 0674US8865835B2Solar cell sealing material and solar cell module produced using the sameTANIGUCHI KOUICHIROU·Filed 2010·Granted Oct 21, 2014·2 cites·19 claims
- 0772US7554158B2Semiconductor device having analog and digital circuitsNEC ELECTRONICS CORP·Filed 2006·Granted Jun 30, 2009·5 cites·11 claims
- 0870US7733192B2Voltage controlled oscillatorNEC ELECTRONICS CORP·Filed 2008·Granted Jun 8, 2010·4 cites·10 claims
- 0970US7091576B2Inductor for semiconductor integrated circuit and method of fabricating the sameNEC ELECTRONICS CORP·Filed 2003·Granted Aug 15, 2006·14 cites·1 claims
- 1069US7705422B2Semiconductor device including metal-insulator-metal capacitor arrangementNEC ELECTRONICS CORP·Filed 2005·Granted Apr 27, 2010·3 cites·6 claims
- 1169US7256456B2SOI substrate and semiconductor integrated circuit deviceNEC ELECTRONICS CORP·Filed 2003·Granted Aug 14, 2007·13 cites·23 claims
- 1267US7053165B2Semiconductor integrated circuit including an inductor and method of manufacturing the sameNEC ELECTRONICS CORP·Filed 2003·Granted May 30, 2006·14 cites·20 claims
- 1366US7339249B2Semiconductor deviceNEC ELECTRONICS CORP·Filed 2005·Granted Mar 4, 2008·3 cites·21 claims
- 1466US2025048796A1Light-emitting elementNICHIA CORP·Filed 2024·Application pending·0 cites
- 1565US7414506B2Semiconductor integrated circuit and fabrication method thereofNEC ELECTRONICS CORP·Filed 2004·Granted Aug 19, 2008·12 cites·17 claims
- 1661US12023999B2Wing lock structure, cargo bed, and vehicleISUZU MOTORS LTD·Filed 2021·Granted Jul 2, 2024·0 cites·5 claims
- 1758US7432551B2SOI semiconductor device including a guard ring regionNEC ELECTRONICS CORP·Filed 2006·Granted Oct 7, 2008·1 cites·7 claims
- 1857US2025170155A1Nucleoside derivatives and prodrugs thereof having viral growth inhibitory actionSHIONOGI & CO·Filed 2022·Application pending·0 cites
- 1954US2015367600A1Transparent double-sided adhesive sheet, laminate obtained using same for constituting image display device, process for producing said laminate, and image display device obtained using said laminateMITSUBISHI PLASTICS INC·Filed 2014·Application pending·0 cites
- 2053US7432170B2Semiconductor device and fabrication method thereofNEC ELECTRONICS CORP·Filed 2004·Granted Oct 7, 2008·5 cites·8 claims
- 2152US6995450B2Semiconductor device with a frequency selective guard ringNEC ELECTRONICS CORP·Filed 2004·Granted Feb 7, 2006·5 cites·14 claims
- 2252US2015225625A1Double-sided pressure-sensitive adhesive sheet with repeeling properties and method for repeeling sameMITSUBISHI PLASTICS INC·Filed 2013·Application pending·0 cites
- 2351US8378454B2Semiconductor device including metal-insulator-metal capacitor arrangementRENESAS ELECTRONICS CORP·Filed 2011·Granted Feb 19, 2013·0 cites·6 claims
- 2451US7361845B2Wiring line for high frequencyNEC ELECTRONICS CORP·Filed 2003·Granted Apr 22, 2008·4 cites·19 claims
- 2549US7986026B2Semiconductor device including metal-insulator-metal capacitor arrangementRENESAS ELECTRONICS CORP·Filed 2010·Granted Jul 26, 2011·0 cites·5 claims
- 2649US2007262383A1Soi substrate and semiconductor integrated ciruit deviceNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 2747US2006231923A1Inductor for semiconductor integrated circuit and method of fabricating the sameNEC ELECTRONICS CORP·Filed 2006·Application pending·0 cites
- 2847US2013206214A1Solar battery cover film for and solar battery module manufactured using sameAKAIKE OSAMU·Filed 2011·Application pending·0 cites
- 2944US2008048294A1Semiconductor device with guard ringNEC ELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 3037US2009189650A1PLL circuit including voltage controlled oscillator having voltage-current conversion circuitNEC ELECTRONICS CORP·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →