Inventor · disambiguated record
Ryuhei Yokota
Also filed as: YOKOTA RYUHEI
8 granted patents·13 pending applications·6 citations·filing 2009–2025
76Inventor score
Top patents by PatentIndex Score
21 records- 0178US12305036B2Epoxy resin composition for semiconductor encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2020·Granted May 20, 2025·1 cites·15 claims
- 0268US2024263004A1Resin composition for encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 0367US2025382494A1Motor-sealing resin compositionSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 0462US9030326B2Electronic apparatus and operation control methodTOSHIBA KK·Filed 2013·Granted May 12, 2015·1 cites·10 claims
- 0559US9633921B2Semiconductor encapsulation resin composition and semiconductor device comprised of cured product of the semiconductor encapsulation resin compositionSHINETSU CHEMICAL CO·Filed 2016·Granted Apr 25, 2017·1 cites·6 claims
- 0659US9038164B2Electronic device, electronic device controlling method, and computer program productNUNAMI TSUKASA·Filed 2012·Granted May 19, 2015·2 cites·6 claims
- 0759US2022372274A1Resin composition for encapsulation and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2022·Application pending·0 cites
- 0853US9958920B2Electronic device and methodTOSHIBA KK·Filed 2015·Granted May 1, 2018·1 cites·10 claims
- 0952US2023399467A1Resin composition for encapsulating semiconductor element-mounted surface of substrate with semiconductor element mounted thereon or semiconductor element-forming surface of wafer with semiconductor element formed thereon, and use thereofSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 1050US10851261B2Semiconductor-encapsulating epoxy resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2019·Granted Dec 1, 2020·0 cites·6 claims
- 1150US9041701B2Electronic apparatus, electronic apparatus controlling method, and computer program productTOSHIBA KK·Filed 2012·Granted May 26, 2015·0 cites·5 claims
- 1248US2010199112A1Information processing apparatus and power supply control methodTOSHIBA KK·Filed 2009·Application pending·0 cites
- 1345US2023312909A1Thermosetting resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 1444US2015188348A1Power supply circuit and electronic deviceTOSHIBA KK·Filed 2014·Application pending·0 cites
- 1544US2009315675A1Information Processing Device and Indication Control MethodTOSHIBA KK·Filed 2009·Application pending·0 cites
- 1642US2013162198A1Information processing apparatus and control methodTOSHIBA KK·Filed 2012·Application pending·0 cites
- 1740US2013229337A1Electronic device, electronic device controlling method, computer program productTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1836US2021024749A1Heat-curable maleimide resin composition and semiconductor deviceSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 1935US10459014B2Electronic deviceTOSHIBA KK·Filed 2017·Granted Oct 29, 2019·0 cites·18 claims
- 2035US2019127580A1Semiconductor Encapsulating Resin Composition and Semiconductor DeviceSHINETSU CHEMICAL CO·Filed 2018·Application pending·0 cites
- 2132US2016251511A1Resin composition for encapsulating a semiconductor element and a semiconductor deviceSHINETSU CHEMICAL CO·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →