Inventor · disambiguated record
Ryo Yukioka
Also filed as: YUKIOKA RYO
0 granted patents·6 pending applications·0 citations·filing 2021–2024
Files withRESONAC CORP6
Top patents by PatentIndex Score
6 records- 0164US2025224672A1Photosensitive resin film, printed wiring board, semiconductor package, and method for manufacturing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0258US2025297129A1Photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2024·Application pending·0 cites
- 0352US2024393686A1Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 0451US2025306465A1Photosensitive multilayer resin film, printed wiring board, semiconductor package, and method for producing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0551US2025226236A1Photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0649US2025227853A1Photosensitive multilayer resin film, printed wiring board, semiconductor package, and method for producing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →