Inventor · disambiguated record
S. Hinkle
Also filed as: HINKLE S D · HINKLE S DEREK
9 granted patents·6 pending applications·423 citations·filing 1996–2006
91Inventor score
Technology areasH10W
Top patents by PatentIndex Score
15 records- 0197US6140154AMulti-part lead frame with dissimilar materials and method of manufacturingMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 31, 2000·152 cites·15 claims
- 0297US6072228AMulti-part lead frame with dissimilar materials and method of manufacturingMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 6, 2000·201 cites·73 claims
- 0386US6362022B1Multi-part lead frame with dissimilar materials and method of manufacturingMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 26, 2002·24 cites·15 claims
- 0482US7321160B2Multi-part lead frameMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 22, 2008·5 cites·6 claims
- 0575US6885108B2Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking thereinMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 26, 2005·16 cites·33 claims
- 0666US6946722B2Multi-part lead frame with dissimilar materialsMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 20, 2005·6 cites·18 claims
- 0766US6902952B2Multi-part lead frame with dissimilar materials and method of manufacturingMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 7, 2005·6 cites·13 claims
- 0861US6570244B1Multi-part lead frame with dissimilar materialsMICRON TECHNOLOGY INC·Filed 1999·Granted May 27, 2003·12 cites·73 claims
- 0960US7199464B2Semiconductor device structures including protective layers formed from healable materialsMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 3, 2007·1 cites·31 claims
- 1053US2007001274A1Multi-part lead frame with dissimilar materialsHINKLE S D·Filed 2006·Application pending·0 cites
- 1153US2007057353A1Multi-part lead frame with dissimilar materialsHINKLE S D·Filed 2006·Application pending·0 cites
- 1253US2007057354A1Multi-part lead frame with dissimilar materialsHINKLE S D·Filed 2006·Application pending·0 cites
- 1352US2006125065A1Multi-part lead frame with dissimilar materialsHINKLE S D·Filed 2006·Application pending·0 cites
- 1451US2005146002A1Multi-part lead frame with dissimilar materialsFiled 2005·Application pending·0 cites
- 1542US2004198023A1Methods for forming protective layers on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking thereinFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →