Inventor · disambiguated record
Sairam Agraharam
Also filed as: AGRAHARAM SAIRAM
47 granted patents·22 pending applications·214 citations·filing 2001–2025
97Inventor score
Top patents by PatentIndex Score
69 records- 0198US11626372B2Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2021·Granted Apr 11, 2023·4 cites·18 claims
- 0297US8987918B2Interconnect structures with polymer coreINTEL CORP·Filed 2013·Granted Mar 24, 2015·54 cites·25 claims
- 0396US10916514B2Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2019·Granted Feb 9, 2021·9 cites·20 claims
- 0494US9129958B23D integrated circuit package with window interposerMALLIK DEBENDRA·Filed 2011·Granted Sep 8, 2015·17 cites·24 claims
- 0590US10461047B2Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2015·Granted Oct 29, 2019·5 cites·25 claims
- 0689US2025070056A1Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0788US10700051B2Multi-chip packagingINTEL CORP·Filed 2018·Granted Jun 30, 2020·4 cites·24 claims
- 0885US7535114B2Integrated circuit devices including compliant material under bond pads and methods of fabricationINTEL CORP·Filed 2005·Granted May 19, 2009·14 cites·27 claims
- 0983US12476235B2Multi-chip packagingINTEL CORP·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 1082US12170253B2Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 1182US12074121B2Metal-free frame design for silicon bridges for semiconductor packagesINTEL CORP·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
- 1282US8970051B2Solution to deal with die warpage during 3D die-to-die stackingSHI HUALIANG·Filed 2013·Granted Mar 3, 2015·12 cites·18 claims
- 1382US7170098B2Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heatINTEL CORP·Filed 2005·Granted Jan 30, 2007·8 cites·6 claims
- 1480US8952532B2Integrated circuit package with spatially varied solder resist opening dimensionZHENG TIEYU·Filed 2013·Granted Feb 10, 2015·7 cites·18 claims
- 1580US6989586B2Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systemsINTEL CORP·Filed 2003·Granted Jan 24, 2006·27 cites·38 claims
- 1680US6770966B2Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heatINTEL CORP·Filed 2001·Granted Aug 3, 2004·21 cites·10 claims
- 1779US12027448B2Open cavity bridge power delivery architectures and processesINTEL CORP·Filed 2020·Granted Jul 2, 2024·1 cites·11 claims
- 1878US7517787B2C4 joint reliabilityINTEL CORP·Filed 2005·Granted Apr 14, 2009·8 cites·7 claims
- 1977US10256198B2Warpage control for microelectronics packagesINTEL CORP·Filed 2017·Granted Apr 9, 2019·2 cites·21 claims
- 2077US8941128B2Passivation layer for flexible displayPILLARISETTY RAVI·Filed 2012·Granted Jan 27, 2015·2 cites·26 claims
- 2176US12199085B2Multi-chip packagingINTEL CORP·Filed 2022·Granted Jan 14, 2025·0 cites·23 claims
- 2276US9391013B23D integrated circuit package with window interposerINTEL CORP·Filed 2015·Granted Jul 12, 2016·2 cites·22 claims
- 2375US11817444B2Multi-chip packagingINTEL CORP·Filed 2022·Granted Nov 14, 2023·0 cites·20 claims
- 2474US9603247B2Electronic package with narrow-factor via including finish layerINTEL CORP·Filed 2014·Granted Mar 21, 2017·3 cites·18 claims
- 2572US9374509B2Wearable imaging sensor for communicationsPILLARISETTY RAVI·Filed 2012·Granted Jun 21, 2016·1 cites·19 claims
- 2672US2025015028A1Singulation of microelectronic components with direct bonding interfacesINTEL CORP·Filed 2024·Application pending·0 cites
- 2771US11348911B2Multi-chip packagingINTEL CORP·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 2867US9312237B2Integrated circuit package with spatially varied solder resist opening dimensionINTEL CORP·Filed 2014·Granted Apr 12, 2016·2 cites·6 claims
- 2964US6921706B2Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heatINTEL CORP·Filed 2004·Granted Jul 26, 2005·8 cites·6 claims
- 3064US2021391281A1Warpage control for microelectronics packagesINTEL CORP·Filed 2021·Application pending·0 cites
- 3163US12119317B2Singulation of microelectronic components with direct bonding interfacesINTEL CORP·Filed 2020·Granted Oct 15, 2024·0 cites·19 claims
- 3262US2025167062A1Microelectronic structures including bridgesINTEL CORP·Filed 2025·Application pending·0 cites
- 3361US7432532B2Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heatINTEL CORP·Filed 2006·Granted Oct 7, 2008·1 cites·4 claims
- 3460US2016183604A1Wearable imaging sensor with wireless remote communicationsINTEL CORP·Filed 2016·Application pending·0 cites
- 3559US12334472B2Multiple wafer stack architecture to enable singulationINTEL CORP·Filed 2021·Granted Jun 17, 2025·0 cites·20 claims
- 3658US11114388B2Warpage control for microelectronics packagesINTEL CORP·Filed 2019·Granted Sep 7, 2021·0 cites·19 claims
- 3758US2025279384A1Methods and apparatus using polymer material to fill gaps between semiconductor diesINTEL CORP·Filed 2024·Application pending·0 cites
- 3858US2025300129A1Integrated circuit packages including multi-die stacks having tapered sidewallsINTEL CORP·Filed 2024·Application pending·0 cites
- 3958US2025293137A13d die stack redistribution layer for topside power delivery to backside die metallization in multichip composite devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 4057US12243792B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Mar 4, 2025·0 cites·20 claims
- 4157US7465651B2Integrated circuit packages with reduced stress on die and associated methodsINTEL CORP·Filed 2005·Granted Dec 16, 2008·1 cites·11 claims
- 4257US2025112174A1Annealed shape memory alloy on a substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 4355US10128225B2Interconnect structures with polymer coreINTEL CORP·Filed 2017·Granted Nov 13, 2018·0 cites·7 claims
- 4455US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 4554US2024222301A1Methods and apparatus for optical thermal treatment in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 4654US2019304931A1Non-rectangular electronic device componentsINTEL CORP·Filed 2018·Application pending·0 cites
- 4753US12469801B2Moisture seal coating of hybrid bonded stacked die package assemblyINTEL CORP·Filed 2021·Granted Nov 11, 2025·0 cites·18 claims
- 4853US10090259B2Non-rectangular electronic device componentsINTEL CORP·Filed 2015·Granted Oct 2, 2018·0 cites·10 claims
- 4953US9526285B2Flexible computing fabricALEKSOV ALEKSANDAR·Filed 2012·Granted Dec 27, 2016·0 cites·20 claims
- 5052US12176268B2Open cavity bridge co-planar placement architectures and processesINTEL CORP·Filed 2020·Granted Dec 24, 2024·0 cites·6 claims
Showing the top 50 of 69 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →