Inventor · disambiguated record
Sangmin An
Also filed as: AN SANGMIN
2 granted patents·0 citations·filing 2021–2023
22Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0151US12494406B2Semiconductor package and method of providing surface temperature of semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 0236US12205852B2Test method of storage device implemented in multi-chip package (MCP) and method of manufacturing an MCP including the test methodSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 21, 2025·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →