Inventor · disambiguated record
Samuel J. Anderson
Also filed as: ANDERSON JAMES M · ANDERSON SAMUEL · ANDERSON SAMUEL J · ANDERSON SAMUEL JESSE
58 granted patents·19 pending applications·567 citations·filing 1977–2024
98Inventor score
Files withICEMOS TECH LIMITED14GREAT WALL SEMICONDUCTOR CORP13MOTOROLA INC13DUMITRU DOUGLAS12ANDERSON SAMUEL4
Top patents by PatentIndex Score
77 records- 0195US7842568B2Lateral power semiconductor device for high frequency power conversion system, has isolation layer formed over substrate for reducing minority carrier storage in substrateGREAT WALL SEMICONDUCTOR CORP·Filed 2007·Granted Nov 30, 2010·43 cites·9 claims
- 0292US10817185B1Fast block device, system and methodologyDUMITRU DOUGLAS·Filed 2017·Granted Oct 27, 2020·6 cites·19 claims
- 0390US4224974AMounting bracket for venetian blind assemblyINT BLIND CO·Filed 1978·Granted Sep 30, 1980·60 cites·7 claims
- 0488US5666269AMetal matrix composite power dissipation apparatusMOTOROLA INC·Filed 1996·Granted Sep 9, 1997·120 cites·11 claims
- 0586US8946814B2Superjunction devices having narrow surface layout of terminal structures, buried contact regions and trench gatesICEMOS TECHNOLOGY LTD·Filed 2013·Granted Feb 3, 2015·8 cites·10 claims
- 0684US8736019B2Semiconductor devices with sealed, unlined trenches and methods of forming sameANDERSON SAMUEL·Filed 2011·Granted May 27, 2014·6 cites·10 claims
- 0782US12045162B1System, method and apparatus for accelerating fast block devicesDUMITRU DOUGLAS·Filed 2023·Granted Jul 23, 2024·0 cites·14 claims
- 0882US10540955B1Dual-driver loudspeaker with active noise cancellationAMAZON TECH INC·Filed 2018·Granted Jan 21, 2020·4 cites·20 claims
- 0981US7605435B2Bi-directional MOSFET power switch with single metal layerGREAT WALL SEMICONDUCTOR CORP·Filed 2007·Granted Oct 20, 2009·9 cites·4 claims
- 1080US8716829B2Semiconductor devices with sealed, unlined trenches and methods of forming sameANDERSON SAMUEL·Filed 2011·Granted May 6, 2014·4 cites·10 claims
- 1179US12332775B1Fast block device, system and methodologyDUMITRU DOUGLAS·Filed 2022·Granted Jun 17, 2025·0 cites·15 claims
- 1279US11362042B2Semiconductor device with oxide-nitride stackICEMOS TECH CORPORATION·Filed 2020·Granted Jun 14, 2022·2 cites·28 claims
- 1379US8380944B2Fast block device and methodologyDUMITRU DOUGLAS·Filed 2008·Granted Feb 19, 2013·5 cites·26 claims
- 1479US7944018B2Semiconductor devices with sealed, unlined trenches and methods of forming sameICEMOS TECHNOLOGY LTD·Filed 2007·Granted May 17, 2011·5 cites·1 claims
- 1579USD251467SBottom rail of a venetian blind assemblyINT BLIND CO·Filed 1977·Granted Apr 3, 1979·14 cites·1 claims
- 1678US9006099B2Semiconductor device and method of forming a power MOSFET with interconnect structure silicide layer and low profile bumpANDERSON SAMUEL J·Filed 2011·Granted Apr 14, 2015·6 cites·6 claims
- 1777US8963239B2800 V superjunction deviceICEMOS TECHNOLOGY LTD·Filed 2014·Granted Feb 24, 2015·4 cites·18 claims
- 1877US8129252B2Semiconductor devices with sealed, unlined trenches and methods of forming sameANDERSON SAMUEL·Filed 2009·Granted Mar 6, 2012·4 cites·16 claims
- 1977US4177853AVenetian blind assembly and mounting means thereforINT BLIND CO·Filed 1977·Granted Dec 11, 1979·36 cites·8 claims
- 2076US12230674B2Radiation hardened high voltage superjunction MOSFETICEMOS TECH LIMITED·Filed 2023·Granted Feb 18, 2025·0 cites·27 claims
- 2176US9640638B2Semiconductor device and method of forming a power MOSFET with interconnect structure to achieve lower RDSONGREAT WALL SEMICONDUCTOR CORP·Filed 2013·Granted May 2, 2017·4 cites·25 claims
- 2276US8138558B2Semiconductor device and method of forming low voltage MOSFET for portable electronic devices and data processing centersSHEA PATRICK M·Filed 2010·Granted Mar 20, 2012·4 cites·22 claims
- 2376US5371043AMethod for forming a power circuit packageMOTOROLA INC·Filed 1994·Granted Dec 6, 1994·45 cites·16 claims
- 2473US11687445B1System, method and apparatus for accelerating fast block devicesDUMITRU DOUGLAS·Filed 2020·Granted Jun 27, 2023·0 cites·19 claims
- 2572US11757001B2Radiation hardened high voltage superjunction MOSFETICEMOS TECH LIMITED·Filed 2022·Granted Sep 12, 2023·0 cites·24 claims
- 2672US11455099B1Fast block device, system and methodologyDUMITRU DOUGLAS·Filed 2020·Granted Sep 27, 2022·0 cites·6 claims
- 2772US9092325B2Fast block device and methodologyDUMITRU DOUGLAS·Filed 2014·Granted Jul 28, 2015·1 cites·21 claims
- 2872US8921186B2Semiconductor device and method of forming high voltage SOI lateral double diffused MOSFET with shallow trench insulatorSHEA PATRICK M·Filed 2009·Granted Dec 30, 2014·6 cites·12 claims
- 2972US2024405068A1Semiconductor Device and Method of Forming MEMS Super-Junction Metal Oxide Semiconductor Using Epitaxial LayerICEMOS TECH LIMITED·Filed 2024·Application pending·0 cites
- 3072US2024405067A1Semiconductor Device and Method of Forming MEMS Super-Junction Metal Oxide Semiconductor Using Vapor Phase DepositionICEMOS TECH LIMITED·Filed 2024·Application pending·0 cites
- 3169US10860255B1System, method and apparatus for accelerating fast block devicesDUMITRU DOUGLAS·Filed 2019·Granted Dec 8, 2020·0 cites·6 claims
- 3269US5119148AFast damper diode and methodMOTOROLA INC·Filed 1991·Granted Jun 2, 1992·31 cites·10 claims
- 3368US9299774B2Device structure and methods of forming superjunction lateral power MOSFET with surrounding LDDGREAT WALL SEMICONDUCTOR CORP·Filed 2014·Granted Mar 29, 2016·2 cites·25 claims
- 3466US9461109B1Method of forming superjunction high voltage devices using wafer bondingICEMOS TECH LTD·Filed 2015·Granted Oct 4, 2016·2 cites·20 claims
- 3565US5786230AMethod of fabricating multi-chip packagesMOTOROLA INC·Filed 1995·Granted Jul 28, 1998·33 cites·21 claims
- 3665US5616886AWirebondless module packageMOTOROLA INC·Filed 1995·Granted Apr 1, 1997·33 cites·9 claims
- 3764US9147751B2Methods of manufacturing superjunction devicesICEMOS TECHNOLOGY LTD·Filed 2014·Granted Sep 29, 2015·1 cites·3 claims
- 3861US12222316B2Semiconductor device providing a biosensor to test for pathogenICEMOS TECH LIMITED·Filed 2021·Granted Feb 11, 2025·0 cites·28 claims
- 3961US11362179B2Radiation hardened high voltage superjunction MOSFETICEMOS TECH LTD·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 4061US7800223B2Chip-scale monolithic load switch for portable applicationsGREAT WALL SEMICONDUCTOR CORP·Filed 2006·Granted Sep 21, 2010·2 cites·21 claims
- 4160US12506006B2Semiconductor device and method of direct wafer bonding between semiconductor layer containing similar WBG materialsICEMOS TECH LIMITED·Filed 2022·Granted Dec 23, 2025·0 cites·29 claims
- 4260US9535830B2Fast block device and methodologyDUMITRU DOUGLAS·Filed 2015·Granted Jan 3, 2017·0 cites·20 claims
- 4359US11935839B2Semiconductor device with oxide-nitride stackICEMOS TECH CORPORATION·Filed 2022·Granted Mar 19, 2024·0 cites·34 claims
- 4459US5751009AOptical isolator having leadframe with non-planar mounting portionsMOTOROLA INC·Filed 1996·Granted May 12, 1998·25 cites·20 claims
- 4558US8812778B2Fast block device and methodologyDUMITRU DOUGLAS·Filed 2013·Granted Aug 19, 2014·0 cites·23 claims
- 4657US2025036298A1System, method and apparatus for improved local object storageDUMITRU DOUGLAS·Filed 2024·Application pending·0 cites
- 4756US2025157813A1Semiconductor Device and Method of Forming Silicon Carbide Switch-Back Engineered SubstrateICEMOS TECH LIMITED·Filed 2024·Application pending·0 cites
- 4855US10248359B2System, method and apparatus for accelerating fast block devicesDUMITRU DOUGLAS·Filed 2008·Granted Apr 2, 2019·0 cites·20 claims
- 4955US2019165093A1Insuperjunction with surrounding lightly doped drain regionRENESAS ELECTRONICS AMERICA INC·Filed 2019·Application pending·0 cites
- 5054US11545565B2Semiconductor device and method of forming low voltage power MOSFETs using graphene for metal layers and graphene nanoribbons for channel and drain enhancement regions of power vertical and lateral MOSFETsICEMOS TECH LIMITED·Filed 2020·Granted Jan 3, 2023·0 cites·30 claims
Showing the top 50 of 77 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →