Inventor · disambiguated record
Sangwoo Bae
Also filed as: BAE SANGWOO
7 granted patents·14 pending applications·1 citations·filing 2003–2025
69Inventor score
Top patents by PatentIndex Score
21 records- 0180US2025342805A1Display device, display system, and driving method of display deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0277US11823961B2Substrate inspection system and method of manufacturing semiconductor device using substrate inspection systemSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 21, 2023·1 cites·20 claims
- 0373US12361879B2Display device configured to generate a data signal based on a pixel drive voltage, display system, and driving method of display deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·16 claims
- 0467US2024399506A1Substrate processing apparatus and substrate processing method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0563US2009176888A1Composition comprising phytosphingosine or derivative thereofKOREA INST RADL & MED SCIENCES·Filed 2009·Application pending·0 cites
- 0662US12313393B2Level sensor and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 0761US2025137136A1Layer deposition apparatus and layer deposition methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0859US2025224328A1Device for measuring semiconductorsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0954US2025264324A1Semiconductor measurement system having monochromator and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1054US2024218561A1Thin-film deposition apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1153US11946809B2Polarization measuring device and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 2, 2024·0 cites·19 claims
- 1252US2024105524A1Optical device, die bonding system, and die bonding methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1352US2025052559A1Measuring parallelismSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1452US2024019362A1Probe and inspection apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1550US12366444B2Optical assembly for parallelism measurement, optical apparatus including the same, die bonding system and die bonding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 1650US2025334393A1Semiconductor measuring device using beam displacerSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1750US2007021511A1Composition comprising phytosphingosine or a derivative thereofLEE SU J·Filed 2003·Application pending·0 cites
- 1848US11823927B2Wafer inspection apparatus and system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·20 claims
- 1948US2022120662A1Particle inspection device based on spatial modulation method and particle inspection method using the particle inspection deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 2042US2010060874A1Maskless lithographic apparatus and methods of compensation for rotational alignment error using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2138US10401301B2Optical test system and method, and method of manufacturing semiconductor device by using the optical test system and methodSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 3, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →