Inventor · disambiguated record
Sangjin Baek
Also filed as: BAEK SANGJIN
0 granted patents·9 pending applications·0 citations·filing 2023–2025
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0158US2025062241A1Semiconductor package including a plurality of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0257US2024243053A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0357US2024332270A1Semiconductor package with decoupling capacitor and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0456US2025046691A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0555US2024186231A1Semiconductor package including a redistribution structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0655US2024332157A1Semiconductor package including a redistribution structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0754US2024178122A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0852US2024120280A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0944US2025309205A1Semiconductor package having chips arranged in a step type structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →