Inventor · disambiguated record
Sang-Mao Chiu
Also filed as: CHIU SANG-MAO
1 granted patent·6 pending applications·118 citations·filing 2004–2025
54Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0190US6962864B1Wire-bonding method for chips with copper interconnects by introducing a thin layerNAT UNIV CHUNG CHENG·Filed 2004·Granted Nov 8, 2005·118 cites·7 claims
- 0260US2025233040A1Semiconductor package structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0357US2025174533A1Semiconductor package structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0455US2025038126A1Semiconductor package having electromagnetic interference shielding structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0554US2025372547A1Semiconductor structureMEDIATEK INC·Filed 2025·Application pending·0 cites
- 0645US2021217707A1Semiconductor package having re-distribution layer structure on substrate componentMEDIATEK INC·Filed 2020·Application pending·0 cites
- 0743US2025239517A1Semiconductor package and method for forming the sameMEDIATEK INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →