Inventor · disambiguated record
Sang-Kook Choi
Also filed as: CHOI SANG-KOOK
9 granted patents·2 pending applications·76 citations·filing 1995–2008
88Inventor score
Top patents by PatentIndex Score
11 records- 0170US8164148B2Method of generating strong spin waves and spin devices for ultra-high speed information processing using spin wavesKIM SANG-KOOG·Filed 2006·Granted Apr 24, 2012·8 cites·46 claims
- 0260US6837619B2Furnace temperature detectorSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 4, 2005·7 cites·6 claims
- 0358US6340625B1Method for simultaneously forming thinner and thicker parts of a dual oxide layer having varying thicknessesSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Jan 22, 2002·7 cites·8 claims
- 0452US6068316ALarge diameter wafer conveying system and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted May 30, 2000·17 cites·13 claims
- 0550US6207588B1Method for simultaneously forming thinner and thicker parts of a dual oxide layer having varying thicknessesSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Mar 27, 2001·17 cites·1 claims
- 0646US2008255697A1Vertical furnace having lot-unit transfer function and related transfer control methodSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0742US2007181192A1Method and apparatus for monitoring gas flow amount in semiconductor manufacturing equipmentCHOI SANG-KOOK·Filed 2006·Application pending·0 cites
- 0841US5753046AVertical diffusion furnace and cap thereforSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted May 19, 1998·6 cites·5 claims
- 0938US5704984AChemical vapor deposition apparatus with a heat radiation structureSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Jan 6, 1998·8 cites·7 claims
- 1030US5780317AApparatus for forming oxide film of semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Jul 14, 1998·3 cites·3 claims
- 1129US5616025AVertical diffusion furnace having improved gas flowSAMSUNG ELECTRONICS CO LTD·Filed 1995·Granted Apr 1, 1997·3 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →