Inventor · disambiguated record

Sanghun Chun

Also filed as: CHUN SANGHUN

7 granted patents·13 pending applications·2 citations·filing 2021–2024

71Inventor score

Technology areasH10W H10B

Files withSAMSUNG ELECTRONICS CO LTD20

Top patents by PatentIndex Score

20 records

0193US12120882B2Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 15, 2024·2 cites·17 claims
0281US2025008737A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0379US2025107092A1Semiconductor devices and data storage systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0473US12131995B2Semiconductor device and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
0572US2025014997A1Semiconductor device and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0667US2025267870A1Non-volatile memory device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0766US2025324596A1Semiconductor device and an electronic system including the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
0865US12185543B2Semiconductor devices comprising crack preventing layers and data storage systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
0963US11791262B2Semiconductor device and data storage system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
1062US2025240966A1Integrated circuit memory devices that support chip-scale packagingSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
1159US2024268113A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
1256US2024355735A1Semiconductor devices and data storage systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
1356US2024215252A1Nonvolatile memory device and memory system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
1454US12302563B2Three-dimensional semiconductor memory devices, methods of fabricating the same, and electronic systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 13, 2025·0 cites·19 claims
1552US2024130123A1Semiconductor device, electronic system including the same, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
1650US12302580B2Semiconductor devices and data storage systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 13, 2025·0 cites·19 claims
1749US2024090228A1Three-dimensional semiconductor memory device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
1848US2024032298A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
1947US12355003B2Semiconductor devices and data storage systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
2047US2024063113A1Semiconductor device and an electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →