Inventor · disambiguated record
Sanjay Dandia
Also filed as: DANDIA SANJAY
23 granted patents·483 citations·filing 1994–2023
96Inventor score
Files withADVANCED MICRO DEVICES INC10LSI LOGIC CORP5HENG STEPHEN3HENG STEPHEN F3VLSI TECHNOLOGY INC1
Top patents by PatentIndex Score
23 records- 0197US6198635B1Interconnect layout pattern for integrated circuit packages and the likeVSLI TECHNOLOGY INC·Filed 1999·Granted Mar 6, 2001·186 cites·31 claims
- 0294US9466900B1Circuit board socket with rail frameHENG STEPHEN F·Filed 2015·Granted Oct 11, 2016·13 cites·20 claims
- 0387US8216887B2Semiconductor chip package with stiffener frame and configured lidHENG STEPHEN F·Filed 2009·Granted Jul 10, 2012·17 cites·21 claims
- 0486US5691568AWire bondable package design with maxium electrical performance and minimum number of layersLSI LOGIC CORP·Filed 1996·Granted Nov 25, 1997·106 cites·21 claims
- 0585US10242962B1Back side metallizationADVANCED MICRO DEVICES INC·Filed 2017·Granted Mar 26, 2019·3 cites·16 claims
- 0683USD641720SCircuit package lidADVANCED MICRO DEVICES INC·Filed 2010·Granted Jul 19, 2011·29 cites·1 claims
- 0772US11488922B2Back side metallizationADVANCED MICRO DEVICES INC·Filed 2021·Granted Nov 1, 2022·0 cites·7 claims
- 0864US12482738B2Systems and methods for dimensioning a land grid array padADVANCED MICRO DEVICES INC·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 0962US10957669B2Back side metallizationADVANCED MICRO DEVICES INC·Filed 2019·Granted Mar 23, 2021·0 cites·5 claims
- 1061US10431562B1Back side metallizationADVANCED MICRO DEVICES INC·Filed 2019·Granted Oct 1, 2019·0 cites·12 claims
- 1159US5796171AProgressive staggered bonding padsLSI LOGIC CORP·Filed 1996·Granted Aug 18, 1998·29 cites·13 claims
- 1257USD633880SSocket housingADVANCED MICRO DEVICES INC·Filed 2010·Granted Mar 8, 2011·8 cites·1 claims
- 1355US6246121B1High performance flip-chip semiconductor deviceVLSI TECHNOLOGY INC·Filed 1999·Granted Jun 12, 2001·21 cites·22 claims
- 1453USD645426SSocket assemblyADVANCED MICRO DEVICES INC·Filed 2010·Granted Sep 20, 2011·7 cites·1 claims
- 1553USD633877SSocket frameADVANCED MICRO DEVICES INC·Filed 2010·Granted Mar 8, 2011·8 cites·1 claims
- 1653US5749999AMethod for making a surface-mount technology plastic-package ball-grid array integrated circuitLSI LOGIC CORP·Filed 1994·Granted May 12, 1998·19 cites·4 claims
- 1752US5814892ASemiconductor die with staggered bond padsLSI LOGIC CORP·Filed 1996·Granted Sep 29, 1998·19 cites·13 claims
- 1846US10636736B2Land pad design for high speed terminalsADVANCED MICRO DEVICES INC·Filed 2017·Granted Apr 28, 2020·0 cites·17 claims
- 1946US10389053B2Circuit board socket with rail frameHENG STEPHEN F·Filed 2016·Granted Aug 20, 2019·0 cites·20 claims
- 2044USD648688SSocket housingHENG STEPHEN·Filed 2011·Granted Nov 15, 2011·4 cites·1 claims
- 2143US5753070AVacuum chuck tool for a making a plastic-package ball-grid array integrated circuit, and combinationLSI LOGIC CORP·Filed 1997·Granted May 19, 1998·9 cites·9 claims
- 2237USD658607SCircuit package lidHENG STEPHEN·Filed 2011·Granted May 1, 2012·3 cites·1 claims
- 2336USD661667SSocket assemblyHENG STEPHEN·Filed 2011·Granted Jun 12, 2012·2 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →