Inventor · disambiguated record
Sandip Das
Also filed as: DAS SANDIP
1 granted patent·2 pending applications·0 citations·filing 2017–2022
11Inventor score
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3 records- 0159US11634617B2Adhesive composition, a process of producing the adhesive composition, a bonding method using the adhesive composition, and a structure having the adhesive composition applied thereonNAT INST MATERIALS SCIENCE·Filed 2017·Granted Apr 25, 2023·0 cites·20 claims
- 0257US2025128236A1Crosslinked structure, metal-trapping material including said crosslinked structure, method for recovering metal using said metal-trapping material, and method for manufacturing said crosslinked structureUNIV NAT CORP KANAZAWA·Filed 2022·Application pending·0 cites
- 0352US2024123714A1Consumer productCONOPCO INC DBA UNILEVER·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →