Inventor · disambiguated record
Sachiko Fujisawa
Also filed as: FUJISAWA SACHIKO
6 granted patents·7 pending applications·3 citations·filing 2021–2024
68Inventor score
Files withTOSHIBA KK13
Top patents by PatentIndex Score
13 records- 0192US11948900B2Bonded body, circuit board, and semiconductor deviceTOSHIBA KK·Filed 2021·Granted Apr 2, 2024·2 cites·21 claims
- 0290US12431406B2Bonded body, circuit board, semiconductor device, and method for manufacturing bonded bodyTOSHIBA KK·Filed 2022·Granted Sep 30, 2025·1 cites·20 claims
- 0375US2025048563A1Bonded body, ceramic copper circuit board, method for manufacturing bonded body, and method for manufacturing ceramic copper circuit boardTOSHIBA KK·Filed 2024·Application pending·0 cites
- 0471US12160959B2Bonded body, ceramic copper circuit board, method for manufacturing bonded body, and method for manufacturing ceramic copper circuit boardTOSHIBA KK·Filed 2022·Granted Dec 3, 2024·0 cites·18 claims
- 0565US2025019804A1Rhenium-tungsten alloy wire, method of manufacturing same, medical needle, and probe pinTOSHIBA KK·Filed 2024·Application pending·0 cites
- 0665US2025019805A1Rhenium-tungsten alloy wire, method of manufacturing same, and medical needleTOSHIBA KK·Filed 2024·Application pending·0 cites
- 0762US2023187310A1Bonded body, ceramic circuit substrate, and semiconductor deviceTOSHIBA KK·Filed 2023·Application pending·0 cites
- 0862US2025087576A1Bonded body, ceramic circuit board, semiconductor device, and method for manufacturing bonded bodyTOSHIBA KK·Filed 2024·Application pending·0 cites
- 0962US2025098065A1Bonded body and ceramic circuit board using sameTOSHIBA KK·Filed 2024·Application pending·0 cites
- 1060US12347744B2Bonded body including titanium alloy at bonding boundaryTOSHIBA KK·Filed 2022·Granted Jul 1, 2025·0 cites·14 claims
- 1159US12115603B2Bonded body, ceramic copper circuit substrate, and semiconductor deviceTOSHIBA KK·Filed 2022·Granted Oct 15, 2024·0 cites·17 claims
- 1258US12343820B2Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded bodyTOSHIBA KK·Filed 2022·Granted Jul 1, 2025·0 cites·17 claims
- 1355US2023260868A1Bonded body, ceramic-copper circuit board, and semiconductor deviceTOSHIBA KK·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →