Inventor · disambiguated record
Sanka Ganesan
Also filed as: GANESAN SANKA
59 granted patents·27 pending applications·335 citations·filing 2007–2025
98Inventor score
Top patents by PatentIndex Score
86 records- 0197US11302643B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2020·Granted Apr 12, 2022·5 cites·19 claims
- 0296US12176292B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2023·Granted Dec 24, 2024·2 cites·20 claims
- 0396US9660364B2System interconnect for integrated circuitsINTEL CORP·Filed 2013·Granted May 23, 2017·70 cites·15 claims
- 0496US8188594B2Input/output package architecturesGANESAN SANKA·Filed 2009·Granted May 29, 2012·59 cites·22 claims
- 0595US11817390B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2022·Granted Nov 14, 2023·2 cites·20 claims
- 0694US10170409B2Package on package architecture and method for makingGANESAN SANKA·Filed 2013·Granted Jan 1, 2019·22 cites·20 claims
- 0794US2025391754A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 0893US9233835B2Shaped and oriented solder jointsALEKSOV ALEKSANDAR·Filed 2011·Granted Jan 12, 2016·18 cites·13 claims
- 0992US10658279B2High density package interconnectsINTEL CORP·Filed 2019·Granted May 19, 2020·6 cites·19 claims
- 1091US12170273B2Integrated circuit assemblies with direct chip attach to circuit boardsINTEL CORP·Filed 2021·Granted Dec 17, 2024·2 cites·20 claims
- 1191US11430724B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2017·Granted Aug 30, 2022·5 cites·24 claims
- 1291US9265170B2Integrated circuit connectorsINTEL CORP·Filed 2013·Granted Feb 16, 2016·13 cites·10 claims
- 1391US8513792B2Package-on-package interconnect stiffenerGANESAN SANKA·Filed 2009·Granted Aug 20, 2013·20 cites·18 claims
- 1490US11276630B2Planar integrated circuit package interconnectsINTEL CORP·Filed 2020·Granted Mar 15, 2022·2 cites·20 claims
- 1590US8508947B2Flex cable and method for making the sameGANESAN SANKA·Filed 2010·Granted Aug 13, 2013·11 cites·15 claims
- 1690US7705447B2Input/output package architectures, and methods of using sameINTEL CORP·Filed 2008·Granted Apr 27, 2010·19 cites·35 claims
- 1788US11387175B2Interposer package-on-package (PoP) with solder array thermal contactsINTEL CORP·Filed 2018·Granted Jul 12, 2022·6 cites·16 claims
- 1888US11107757B2Integrated circuit structures in package substratesINTEL CORP·Filed 2020·Granted Aug 31, 2021·2 cites·20 claims
- 1988US10903166B2Integrated circuit packagesGANESAN SANKA·Filed 2016·Granted Jan 26, 2021·5 cites·25 claims
- 2087US9832876B2CPU package substrates with removable memory mechanical interfacesINTEL CORP·Filed 2014·Granted Nov 28, 2017·7 cites·36 claims
- 2187US2025070030A1Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2024·Application pending·0 cites
- 2286US12347782B2Microelectronic assemblies with direct attach to circuit boardsINTEL CORP·Filed 2021·Granted Jul 1, 2025·1 cites·16 claims
- 2386US10651116B2Planar integrated circuit package interconnectsINTEL CORP·Filed 2016·Granted May 12, 2020·3 cites·20 claims
- 2486US9368437B2High density package interconnectsGANESAN SANKA·Filed 2011·Granted Jun 14, 2016·6 cites·28 claims
- 2585US11694959B2Multi-die ultrafine pitch patch architecture and method of makingINTEL CORP·Filed 2019·Granted Jul 4, 2023·3 cites·25 claims
- 2685US7888784B2Substrate package with through holes for high speed I/O flex cableINTEL CORP·Filed 2008·Granted Feb 15, 2011·11 cites·15 claims
- 2785US2025118641A1Planar integrated circuit package interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 2884US12476174B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 2984US9922916B2High density package interconnectsINTEL CORP·Filed 2016·Granted Mar 20, 2018·3 cites·22 claims
- 3083US2025226323A1Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2025·Application pending·0 cites
- 3181US11410919B2Stacked silicon die architecture with mixed flipcip and wirebond interconnectINTEL CORP·Filed 2017·Granted Aug 9, 2022·3 cites·27 claims
- 3281US10672693B2Integrated circuit structures in package substratesINTEL CORP·Filed 2018·Granted Jun 2, 2020·2 cites·21 claims
- 3380US11574851B2Coupled cooling fins in ultra-small systemsINTEL CORP·Filed 2019·Granted Feb 7, 2023·3 cites·23 claims
- 3479US12406914B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 3579US2025029929A1Multi-die ultrafine pitch patch architecture and method of makingINTEL CORP·Filed 2024·Application pending·0 cites
- 3678US12142568B2Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of makingINTEL CORP·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 3778US10784204B2Rlink—die to die channel interconnect configurations to improve signalingINTEL CORP·Filed 2016·Granted Sep 22, 2020·3 cites·22 claims
- 3877US12387999B2Planar integrated circuit package interconnectsINTEL CORP·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 3977US11869842B2Scalable high speed high bandwidth IO signaling package architecture and method of makingINTEL CORP·Filed 2019·Granted Jan 9, 2024·2 cites·17 claims
- 4077US11640942B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2022·Granted May 2, 2023·0 cites·20 claims
- 4177US10658765B2Edge-firing antenna walls built into substrateINTEL CORP·Filed 2018·Granted May 19, 2020·2 cites·32 claims
- 4276US11581287B2Chip scale thin 3D die stacked packageINTEL CORP·Filed 2018·Granted Feb 14, 2023·2 cites·23 claims
- 4376US2022344247A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 4474US10204851B2High density package interconnectsINTEL CORP·Filed 2018·Granted Feb 12, 2019·1 cites·20 claims
- 4574US9564412B2Shaped and oriented solder jointsINTEL CORP·Filed 2015·Granted Feb 7, 2017·2 cites·6 claims
- 4674US8353101B2Method of making substrate package with through holes for high speed I/O flex cableINTEL CORP·Filed 2011·Granted Jan 15, 2013·3 cites·5 claims
- 4774US2025293170A1Microelectronic assemblies with direct attach to circuit boardsINTEL CORP·Filed 2025·Application pending·0 cites
- 4873US2025293121A1Low cost embedded integrated circuit diesINTEL CORP·Filed 2025·Application pending·0 cites
- 4973US2025118698A1Microelectronic assemblies including solder and non-solder interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 5071US11804426B2Integrated circuit structures in package substratesINTEL CORP·Filed 2021·Granted Oct 31, 2023·0 cites·12 claims
Showing the top 50 of 86 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →