Inventor · disambiguated record
Sangsu Ha
Also filed as: HA SANGSU
6 granted patents·2 pending applications·7 citations·filing 2014–2022
69Inventor score
Top patents by PatentIndex Score
8 records- 0183US9402315B2Semiconductor package having magnetic connection memberSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jul 26, 2016·7 cites·5 claims
- 0264US11784139B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 10, 2023·0 cites·16 claims
- 0358US11342283B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 24, 2022·0 cites·15 claims
- 0452US11068150B2Method for compensating for pressure value of force sensor and electronic device using sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 20, 2021·0 cites·15 claims
- 0547US12459770B2Auto splicing device and auto splicing method for electrodeLG ENERGY SOLUTION LTD·Filed 2022·Granted Nov 4, 2025·0 cites·6 claims
- 0647US2023130436A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0742US11749630B2Interconnect structure and semiconductor chip including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·19 claims
- 0838US2017285842A1Electronic device and method of receiving user input thereofSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →