Inventor · disambiguated record
Samuel Hartmann
Also filed as: HARTMANN SAMUEL
15 granted patents·4 pending applications·9 citations·filing 2010–2021
85Inventor score
Files withABB SCHWEIZ AG5ABB TECHNOLOGY AG3ABB POWER GRIDS SWITZERLAND AG2ABB RESEARCH LTD2HITACHI ENERGY SWITZERLAND AG2
Top patents by PatentIndex Score
19 records- 0169US9949385B2Semiconductor module with ultrasonically welded terminalsABB TECHNOLOGY AG·Filed 2015·Granted Apr 17, 2018·3 cites·26 claims
- 0264US9431376B2Substrate for mounting multiple power transistors thereon and power semiconductor moduleABB TECHNOLOGY AG·Filed 2014·Granted Aug 30, 2016·2 cites·14 claims
- 0358US8897015B2Base plateFELLER LYDIA·Filed 2011·Granted Nov 25, 2014·3 cites·20 claims
- 0449US12494409B2Power semiconductor componentHITACHI ENERGY LTD·Filed 2021·Granted Dec 9, 2025·0 cites·15 claims
- 0548US11502434B2Power semiconductor moduleHITACHI ENERGY SWITZERLAND AG·Filed 2019·Granted Nov 15, 2022·0 cites·20 claims
- 0648US11362008B2Power semiconductor module embedded in a mold compounded with an openingHITACHI ENERGY SWITZERLAND AG·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
- 0746US11031323B2Interconnecting member for power moduleABB POWER GRIDS SWITZERLAND AG·Filed 2019·Granted Jun 8, 2021·0 cites·20 claims
- 0846US9000827B2System and method for controlling at least two power semiconductors connected in parallelKLAKA SVEN·Filed 2010·Granted Apr 7, 2015·1 cites·19 claims
- 0945US10854524B2Power semiconductor moduleABB SCHWEIZ AG·Filed 2019·Granted Dec 1, 2020·0 cites·20 claims
- 1042US9105489B2Power semiconductor moduleABB TECHNOLOGY AG·Filed 2013·Granted Aug 11, 2015·0 cites·35 claims
- 1140US11127671B2Power semiconductor moduleABB POWER GRIDS SWITZERLAND AG·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 1239US10224424B2Semiconductor module with two auxiliary emitter conductor pathsABB SCHWEIZ AG·Filed 2016·Granted Mar 5, 2019·0 cites·20 claims
- 1336US10276552B2Semiconductor moduleABB SCHWEIZ AG·Filed 2018·Granted Apr 30, 2019·0 cites·21 claims
- 1435US2013221504A1Semiconductor module and method of manufacturing a semiconductor moduleABB RESEARCH LTD·Filed 2013·Application pending·0 cites
- 1535US2010224674A1Fixture apparatus for low-temperature and low-pressure sinteringABB RESEARCH LTD·Filed 2010·Application pending·0 cites
- 1631US10483244B2Power semiconductor moduleABB SCHWEIZ AG·Filed 2015·Granted Nov 19, 2019·0 cites·9 claims
- 1728US2012199989A1Circuit arrangement and manufacturing method thereofSCHULZ NICOLA·Filed 2012·Application pending·0 cites
- 1827US8410368B2Electrical conductorHARTMANN SAMUEL·Filed 2010·Granted Apr 2, 2013·0 cites·21 claims
- 1927US2017323801A1Method of generating a power semiconductor moduleABB SCHWEIZ AG·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →