Inventor · disambiguated record
Sawa Haruyama
Also filed as: HARUYAMA SAWA
9 granted patents·4 pending applications·3 citations·filing 2019–2024
79Inventor score
Files withROHM CO LTD13
Top patents by PatentIndex Score
13 records- 0184US12471339B2SiC semiconductor deviceROHM CO LTD·Filed 2024·Granted Nov 11, 2025·0 cites·21 claims
- 0280US11626490B2SiC semiconductor deviceROHM CO LTD·Filed 2019·Granted Apr 11, 2023·2 cites·18 claims
- 0378US12255227B2SiC semiconductor deviceROHM CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·19 claims
- 0478US12021120B2SiC semiconductor deviceROHM CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·26 claims
- 0578US2025120148A1SiC SEMICONDUCTOR DEVICEROHM CO LTD·Filed 2024·Application pending·0 cites
- 0676US2025031428A1SEMICONDUCTOR DEVICE WITH SiC SEMICONDUCTOR LAYER AND RAISED PORTION GROUPROHM CO LTD·Filed 2024·Application pending·0 cites
- 0774US12142648B2Semiconductor device with sic semiconductor layer and raised portion groupROHM CO LTD·Filed 2022·Granted Nov 12, 2024·0 cites·6 claims
- 0872US11489051B2Semiconductor device with SiC semiconductor layer and raised portion groupROHM CO LTD·Filed 2019·Granted Nov 1, 2022·1 cites·24 claims
- 0966US2024347646A1Semiconductor deviceROHM CO LTD·Filed 2024·Application pending·0 cites
- 1063US11621319B2SiC semiconductor deviceROHM CO LTD·Filed 2019·Granted Apr 4, 2023·0 cites·17 claims
- 1160US12057512B2Semiconductor deviceROHM CO LTD·Filed 2022·Granted Aug 6, 2024·0 cites·14 claims
- 1251US2024079469A1Semiconductor device and method for manufacturing semiconductor deviceROHM CO LTD·Filed 2023·Application pending·0 cites
- 1345US11916112B2SiC semiconductor deviceROHM CO LTD·Filed 2019·Granted Feb 27, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →