Inventor · disambiguated record
Sami Heinisuo
Also filed as: HEINISUO SAMI · HEINISUO SAMI M · HEINISUO SAMI MARKUS
2 granted patents·11 pending applications·1 citations·filing 2020–2023
30Inventor score
Files withINTEL CORP13
Top patents by PatentIndex Score
13 records- 0174US12193149B2Trace routable radiation shieldINTEL CORP·Filed 2020·Granted Jan 7, 2025·1 cites·17 claims
- 0254US12082332B2Thermal management systems having signal transfer routing for use with electronic devicesINTEL CORP·Filed 2020·Granted Sep 3, 2024·0 cites·20 claims
- 0351US2025008697A1Die contact torsional springsINTEL CORP·Filed 2023·Application pending·0 cites
- 0449US2025003695A1Variable heat pipe thickness and diameter for direct heat pipe attachment and improved thermal managementINTEL CORP·Filed 2023·Application pending·0 cites
- 0549US2025008711A1Method and apparatus for stiffening an electronic deviceINTEL CORP·Filed 2023·Application pending·0 cites
- 0648US2023108868A1Methods and apparatus to increase rigidity of printed circuit boardsINTEL CORP·Filed 2022·Application pending·0 cites
- 0748US2025004505A1Keyboard switch design for ultrathin computing devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 0848US2024292539A1Circuit board interconnect interposer and methodINTEL CORP·Filed 2023·Application pending·0 cites
- 0947US2024389289A1Apparatus and system of electromagnetic interference (emi) shieldingINTEL CORP·Filed 2023·Application pending·0 cites
- 1046US2022418083A1Top side frame stiffener structure for a printed circuit board (pcb) stackINTEL CORP·Filed 2022·Application pending·0 cites
- 1144US2022338340A1Hook and loop attachment for radiation shield and heat sinkINTEL CORP·Filed 2022·Application pending·0 cites
- 1243US2022217848A1Printed circuit board with an edge stiffener structureINTEL CORP·Filed 2022·Application pending·0 cites
- 1334US2021051796A1Ferromagnetic material to shield magnetic fields in substrateINTEL CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →