Inventor · disambiguated record
Satoshi Hibino
Also filed as: HIBINO SATOSHI
17 granted patents·3 pending applications·208 citations·filing 1991–2007
94Inventor score
Files withYAMAHA CORP15MEIJI DAIRIES CORP1MEIJI MILK PROD CO LTD1SANYO ELECTRIC CO1TAISHO PHARMACEUTICAL CO LTD1
Top patents by PatentIndex Score
20 records- 0175US5116995ACarbazole compoundsTAISHO PHARMACEUTICAL CO LTD·Filed 1991·Granted May 26, 1992·18 cites·3 claims
- 0272US5801399ASemiconductor device with antireflection filmYAMAHA CORP·Filed 1997·Granted Sep 1, 1998·43 cites·4 claims
- 0366US5894222ABattery testing method for individually testing secondary batteries by charging and discharging the batteriesSANYO ELECTRIC CO·Filed 1996·Granted Apr 13, 1999·28 cites·36 claims
- 0463US5529955AWiring forming methodYAMAHA CORP·Filed 1994·Granted Jun 25, 1996·37 cites·20 claims
- 0558US2008138509A1Magnetic sensor and manufacturing method thereforYAMAHA CORP·Filed 2007·Application pending·0 cites
- 0650US7075121B2Magnetic tunneling junction element having thin composite oxide filmYAMAHA CORP·Filed 2004·Granted Jul 11, 2006·3 cites·8 claims
- 0749US6764960B2Manufacture of composite oxide film and magnetic tunneling junction element having thin composite oxide filmYAMAHA CORP·Filed 2001·Granted Jul 20, 2004·1 cites·20 claims
- 0849US6375687B1Filling connection hole with wiring material by using centrifugal forceYAMAHA CORP·Filed 2000·Granted Apr 23, 2002·3 cites·9 claims
- 0949US5637924ASemiconductor device having planarized wiring with good thermal resistanceYAMAHA CORP·Filed 1995·Granted Jun 10, 1997·14 cites·20 claims
- 1046US2005063106A1Magnetic sensor and manufacturing method thereforFiled 2004·Application pending·0 cites
- 1144US6150250AConductive layer forming method using etching mask with direction <200>YAMAHA CORP·Filed 1998·Granted Nov 21, 2000·11 cites·19 claims
- 1244US5705429AMethod of manufacturing aluminum wiring at a substrate temperature from 100 to 150 degrees celsiusYAMAHA CORP·Filed 1995·Granted Jan 6, 1998·11 cites·26 claims
- 1342US6022142AMonitor of process temperature and formation of alloyYAMAHA CORP·Filed 1997·Granted Feb 8, 2000·10 cites·11 claims
- 1442US5716869AMethod of forming a wiring layer of a semiconductor device using reflow processYAMAHA CORP·Filed 1996·Granted Feb 10, 1998·10 cites·8 claims
- 1542US2007037782A1Therapeutic agent for ageing macular degenerationMEIJI DAIRIES CORP·Filed 2004·Application pending·0 cites
- 1637US5776827AWiring-forming methodYAMAHA CORP·Filed 1996·Granted Jul 7, 1998·7 cites·19 claims
- 1737US5705426AMethod of forming semiconductor device having planarized wiring with good thermal resistanceYAMAHA CORP·Filed 1996·Granted Jan 6, 1998·6 cites·26 claims
- 1834US6130158AFilling connection hole with wiring material by using centrifugal forceYAMAHA CORP·Filed 1996·Granted Oct 10, 2000·4 cites·10 claims
- 1931US5693629AProgesterone compound and use thereofMEIJI MILK PROD CO LTD·Filed 1995·Granted Dec 2, 1997·2 cites·6 claims
- 2029US6033923AMethods of evaluating titanium nitride and of forming tungsten wiringYAMAHA CORP·Filed 1997·Granted Mar 7, 2000·0 cites·31 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →