Inventor · disambiguated record
Sada Hiroyuki
Also filed as: HIROYUKI SADA
3 granted patents·3 pending applications·0 citations·filing 2012–2025
48Inventor score
Technology areasH10P
Top patents by PatentIndex Score
6 records- 0171US12198982B2Laser dicing for singulationTEXAS INSTRUMENTS INC·Filed 2022·Granted Jan 14, 2025·0 cites·15 claims
- 0267US2025157858A1Laser dicing for singulationTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0361US11482442B2Subring for semiconductor diesTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 25, 2022·0 cites·15 claims
- 0457US11469141B2Laser dicing for singulationTEXAS INSTRUMENTS INC·Filed 2018·Granted Oct 11, 2022·0 cites·7 claims
- 0548US2020075386A1Subring for semiconductor diesTEXAS INSTRUMENTS INC·Filed 2018·Application pending·0 cites
- 0626US2013264686A1Semiconductor wafer processingSHOICHI IRIGUCHI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →