Inventor · disambiguated record
Sangjun Hong
Also filed as: HONG SANGJUN
12 granted patents·27 citations·filing 2018–2023
86Inventor score
Files withSAMSUNG ELECTRONICS CO LTD12
Top patents by PatentIndex Score
12 records- 0193US11456316B2Semiconductor device having word line separation layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 0293US10964714B2Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 30, 2021·12 cites·26 claims
- 0389US11552098B2Semiconductor device including data storage pattern with improved retention characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 10, 2023·2 cites·19 claims
- 0489US11437397B2Three-dimensional semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 6, 2022·6 cites·20 claims
- 0585US11557604B2Semiconductor device and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 17, 2023·3 cites·20 claims
- 0676US12439602B2Semiconductor device including data storage pattern with improved retention characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 0765US12010849B2Semiconductor device having word line separation layerSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 11, 2024·0 cites·20 claims
- 0865US12004350B2Three-dimensional semiconductor memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 0962US12219763B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 1061US11616076B2Three-dimensional semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
- 1154US11335695B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 17, 2022·0 cites·6 claims
- 1245US11653493B2Semiconductor memory device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 16, 2023·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →