Inventor · disambiguated record
Sanghee Park Hui
Also filed as: HUI SANGHEE P · HUI SANGHEE PARK
12 granted patents·318 citations·filing 1992–2001
92Inventor score
Top patents by PatentIndex Score
12 records- 0185US6048751AProcess for manufacture of composite semiconductor devicesLUCENT TECHNOLOGIES INC·Filed 1995·Granted Apr 11, 2000·68 cites·10 claims
- 0283US6169756B1Vertical cavity surface-emitting laser with optical guide and current apertureLUCENT TECHNOLOGIES INC·Filed 1997·Granted Jan 2, 2001·61 cites·34 claims
- 0374US6222206B1Wafer having top and bottom emitting vertical-cavity lasersLUCENT TECHNOLOGIES INC·Filed 1998·Granted Apr 24, 2001·48 cites·11 claims
- 0469US6187653B1Method for attractive bonding of two crystalline substratesLUCENT TECHNOLOGIES INC·Filed 1999·Granted Feb 13, 2001·36 cites·8 claims
- 0569US5667132AMethod for solder-bonding contact pad arraysLUCENT TECHNOLOGIES INC·Filed 1996·Granted Sep 16, 1997·32 cites·15 claims
- 0664US5281542APlanar quantum well photodetectorAT & T BELL LAB·Filed 1993·Granted Jan 25, 1994·23 cites·5 claims
- 0760US6208680B1Optical devices having ZNS/CA-MG-fluoride multi-layered mirrorsLUCENT TECHNOLOGIES INC·Filed 1997·Granted Mar 27, 2001·23 cites·22 claims
- 0848US6485996B2Method of making wafer having top and bottom emitting vertical-cavity lasersLUCENT TECHNOLOGIES INC·Filed 2001·Granted Nov 26, 2002·2 cites·14 claims
- 0946US5223704APlanar buried quantum well photodetectorAT & T BELL LAB·Filed 1992·Granted Jun 29, 1993·10 cites·4 claims
- 1042US5918794ASolder bonding of dense arrays of microminiature contact padsLUCENT TECHNOLOGIES INC·Filed 1995·Granted Jul 6, 1999·9 cites·11 claims
- 1140US6444491B1Composite semiconductor devices and method for manufacture thereofAGERE SYST OPTOELECTRONICS·Filed 2000·Granted Sep 3, 2002·0 cites·8 claims
- 1237US6136667AMethod for bonding two crystalline substrates togetherLUCENT TECHNOLOGIES INC·Filed 1999·Granted Oct 24, 2000·6 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →