Inventor · disambiguated record
Saikumar Jayaraman
Also filed as: JAYARAMAN SAIKUMAR
73 granted patents·26 pending applications·1,442 citations·filing 1995–2024
99Inventor score
Top patents by PatentIndex Score
99 records- 0197US7948090B2Capillary-flow underfill compositions, packages containing same, and systems containing sameINTEL CORP·Filed 2006·Granted May 24, 2011·29 cites·26 claims
- 0297US6790579B1Photoresist compositions comprising polycyclic polymers with acid labile pendant groupsSUMITOMO BAKELITE CO·Filed 2000·Granted Sep 14, 2004·87 cites·28 claims
- 0397US6455650B1Catalyst and methods for polymerizing cycloolefinsGOODRICH CO B F·Filed 1999·Granted Sep 24, 2002·176 cites·97 claims
- 0496US6136499APhotoresist compositions comprising polycyclic polymers with acid labile pendant groupsGOODRICH CO B F·Filed 1997·Granted Oct 24, 2000·121 cites·12 claims
- 0595US6420503B1Norbornene sulfonamide polymersSUMITOMO BAKELITE CO·Filed 2000·Granted Jul 16, 2002·74 cites·20 claims
- 0694US6926955B2Phase change material containing fusible particles as thermally conductive fillerINTEL CORP·Filed 2002·Granted Aug 9, 2005·45 cites·15 claims
- 0793US9859253B1Integrated circuit package stackINTEL CORP·Filed 2016·Granted Jan 2, 2018·12 cites·14 claims
- 0893US7851575B2Polycyclic polymers containing pendant ion conducting moietiesPROMERUS LLC·Filed 2007·Granted Dec 14, 2010·19 cites·7 claims
- 0993US6724091B1Flip-chip system and method of making sameINTEL CORP·Filed 2002·Granted Apr 20, 2004·38 cites·24 claims
- 1093US6121340APhotodefinable dielectric compositions comprising polycyclic polymersGOODRICH CO B F·Filed 1997·Granted Sep 19, 2000·67 cites·33 claims
- 1192US7332807B2Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing sameINTEL CORP·Filed 2005·Granted Feb 19, 2008·26 cites·19 claims
- 1292US7202304B2Anhydride polymers for use as curing agents in epoxy resin-based underfill materialINTEL CORP·Filed 2006·Granted Apr 10, 2007·19 cites·8 claims
- 1392US6981380B2Thermoelectric cooling for microelectronic packages and diceINTEL CORP·Filed 2002·Granted Jan 3, 2006·51 cites·19 claims
- 1492US5912313AAddition polymers of polycycloolefins containing silyl functional groupsGOODRICH CO B F·Filed 1995·Granted Jun 15, 1999·73 cites·74 claims
- 1591US7294394B2Phase change material containing fusible particles as thermally conductive fillerINTEL CORP·Filed 2005·Granted Nov 13, 2007·18 cites·6 claims
- 1691US6903171B2Polymerized cycloolefins using transition metal catalyst and end products thereofPROMERUS LLC·Filed 2002·Granted Jun 7, 2005·46 cites·74 claims
- 1790US7022790B2Photosensitive compositions based on polycyclic polymersSUMITOMO BAKELITE CO·Filed 2003·Granted Apr 4, 2006·34 cites·52 claims
- 1889US7314778B2Wafer-level processing of chip-packaging compositions including bis-maleimidesINTEL CORP·Filed 2005·Granted Jan 1, 2008·8 cites·26 claims
- 1986US6232417B1Photoresist compositions comprising polycyclic polymers with acid labile pendant groupsGOODRICH CO B F·Filed 1997·Granted May 15, 2001·85 cites·13 claims
- 2085US7473995B2Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assemblyINTEL CORP·Filed 2002·Granted Jan 6, 2009·39 cites·12 claims
- 2185US7378456B2Directly photodefinable polymer compositions and methods thereofPROMERUS LLC·Filed 2005·Granted May 27, 2008·7 cites·7 claims
- 2285US6235849B1Method of preparing norbornene sulfonamide polymersGOODRICH CO B F·Filed 2000·Granted May 22, 2001·21 cites·21 claims
- 2384US7311967B2Thermal interface material and electronic assembly having such a thermal interface materialINTEL CORP·Filed 2001·Granted Dec 25, 2007·28 cites·28 claims
- 2483US7252877B2Polymer matrices for polymer solder hybrid materialsINTEL CORP·Filed 2003·Granted Aug 7, 2007·18 cites·28 claims
- 2582US7183139B2Flip-chip system and method of making sameINTEL CORP·Filed 2004·Granted Feb 27, 2007·15 cites·22 claims
- 2682US6723486B2Photoresist compositions comprising polycyclic polymers with acid labile pendant groupsSUMITOMO BAKELITE CO·Filed 2001·Granted Apr 20, 2004·42 cites·19 claims
- 2781US6620512B2Anhydride polymers for use as curing agents in epoxy resin-based underfill materialINTEL CORP·Filed 2001·Granted Sep 16, 2003·23 cites·18 claims
- 2879US8703286B2Polymer matrices for polymer solder hybrid materialsJAYARAMAN SAIKUMAR·Filed 2011·Granted Apr 22, 2014·5 cites·12 claims
- 2979US8053515B2Directly photodefinable polymer compositions and methods thereofPROMERUS LLC·Filed 2007·Granted Nov 8, 2011·6 cites·47 claims
- 3079US7041736B2Anhydride polymers for use as curing agents in epoxy resin-based underfill materialINTEL CORP·Filed 2003·Granted May 9, 2006·22 cites·6 claims
- 3177US7846778B2Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assemblyINTEL CORP·Filed 2002·Granted Dec 7, 2010·24 cites·7 claims
- 3276US7534649B2Thermoset polyimides for microelectronic applicationsINTEL CORP·Filed 2006·Granted May 19, 2009·5 cites·10 claims
- 3376US6451499B1Polycyclic resist compositions with increased etch resistanceGOODRICH CO B F·Filed 2000·Granted Sep 17, 2002·12 cites·16 claims
- 3475US6031058AAddition polymers of polycycloolefins containing silyl functional groupsGOODRICH CO B F·Filed 1999·Granted Feb 29, 2000·24 cites·45 claims
- 3573US8093105B2Method of fabricating a capillary-flow underfill compositionsMANEPALLI RAHUL N·Filed 2011·Granted Jan 10, 2012·3 cites·10 claims
- 3673US7294915B2Underfill and mold compounds including siloxane-based aromatic diaminesINTEL CORP·Filed 2005·Granted Nov 13, 2007·4 cites·3 claims
- 3773US6525153B1Polycyclic polymers containing pendant cyclic anhydride groupsSUMITOMO BAKELITE CO·Filed 2000·Granted Feb 25, 2003·10 cites·8 claims
- 3872US6649714B2Processes for making polymers containing pendant cyclic anhydride groupsSUMITOMO BAKELITE CO·Filed 2003·Granted Nov 18, 2003·8 cites·12 claims
- 3971US7291548B2Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making sameINTEL CORP·Filed 2007·Granted Nov 6, 2007·5 cites·20 claims
- 4069US7312292B2Polycyclic polymers containing pendant ion conducting moietiesPROMERUS LLC·Filed 2004·Granted Dec 25, 2007·9 cites·7 claims
- 4168US9330993B2Methods of promoting adhesion between underfill and conductive bumps and structures formed therebyBAI YIQUN·Filed 2012·Granted May 3, 2016·3 cites·20 claims
- 4268US7084492B2Underfill and mold compounds including siloxane-based aromatic diaminesINTEL CORP·Filed 2003·Granted Aug 1, 2006·11 cites·11 claims
- 4367US9247686B2Polymer matrices for polymer solder hybrid materialsINTEL CORP·Filed 2014·Granted Jan 26, 2016·1 cites·17 claims
- 4467US7776657B2Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing sameINTEL CORP·Filed 2007·Granted Aug 17, 2010·3 cites·10 claims
- 4567US6911726B2Microelectronic packaging and methods for thermally protecting package interconnects and componentsINTEL CORP·Filed 2002·Granted Jun 28, 2005·10 cites·14 claims
- 4666US11456281B2Architecture and processes to enable high capacity memory packages through memory die stackingINTEL CORP·Filed 2018·Granted Sep 27, 2022·1 cites·16 claims
- 4765US7967942B2Polymer matrices for polymer solder hybrid materialsINTEL CORP·Filed 2007·Granted Jun 28, 2011·2 cites·3 claims
- 4865US6147177APolycyclic resist compositions with increased etch resistanceGOODRICH CO B F·Filed 1999·Granted Nov 14, 2000·22 cites·13 claims
- 4964US9646903B2Thermoset polymides for microelectronic applicationsMATAYABAS JR JAMES C·Filed 2014·Granted May 9, 2017·0 cites·7 claims
- 5064US7521115B2Low temperature bumping processINTEL CORP·Filed 2002·Granted Apr 21, 2009·4 cites·5 claims
Showing the top 50 of 99 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →