Inventor · disambiguated record
Sadaaki Kato
Also filed as: KATO SADAAKI
1 granted patent·3 pending applications·3 citations·filing 2018–2023
25Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0175US10808150B2Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging elementHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 20, 2020·3 cites·14 claims
- 0265US2025293105A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0365US2025259859A1Method for manufacturing semiconductor packageRESONAC CORP·Filed 2023·Application pending·0 cites
- 0461US2025287514A1Method for manufacturing electronic component deviceRESONAC CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →