Inventor · disambiguated record
Sang-Duck Kim
Also filed as: KIM SANG DUCK
9 granted patents·8 pending applications·24 citations·filing 2002–2015
81Inventor score
Top patents by PatentIndex Score
17 records- 0174US9050337B2Method for treating atrophic skin scars using a mixture of botulinum toxin and airKIM SANG DUCK·Filed 2012·Granted Jun 9, 2015·3 cites·4 claims
- 0272US7559079B2Realtime service system using the interactive data communication and method thereofKIM SANG-DUCK·Filed 2002·Granted Jul 7, 2009·16 cites·10 claims
- 0361US8418355B2Method for manufacturing circuit boardKIM SANG-DUCK·Filed 2007·Granted Apr 16, 2013·2 cites·7 claims
- 0459US9884001B2Botulinum toxin in aerosol form and method of facial contouring using the sameKIM SANG DUCK·Filed 2015·Granted Feb 6, 2018·0 cites·9 claims
- 0552US8945993B2Method of manufacturing a ball grid array substrate or a semiconductor chip packageSAMSUNG ELECTRO MECH·Filed 2013·Granted Feb 3, 2015·0 cites·6 claims
- 0650US7348772B2Printed circuit board having weak magnetic field sensor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Mar 25, 2008·3 cites·5 claims
- 0748US2009011220A1Carrier and method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0847US8546943B2Ball grid array substrate with insulating layer and semiconductor chip packagePARK JUNG HYUN·Filed 2010·Granted Oct 1, 2013·0 cites·5 claims
- 0945US2012244662A1Board on chip package substrate and manufacturing method thereofKIM JI-EUN·Filed 2012·Application pending·0 cites
- 1044US8986555B2Method of manufacturing printed circuit board having bumpKIM JI-EUN·Filed 2010·Granted Mar 24, 2015·0 cites·4 claims
- 1143US2008102410A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1243US2008105458A1Substrate for mounting flip chip and the manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1342US2011110058A1Board on chip package substrate and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1440US2013161808A1Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1538US2016106653A1Pharmaceutical Composition for Treating Scars on the Skin, and Method for Treating Scars on the Skin Using SameKIM SANG DUCK·Filed 2015·Application pending·0 cites
- 1635US2011266671A1Substrate for a semiconductor package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1734US8889994B2Single-layered printed circuit board and manufacturing method thereofKIM YOUNG-JI·Filed 2011·Granted Nov 18, 2014·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →