Inventor · disambiguated record
Sangsoo Kim
Also filed as: KIM SANGSOO
32 granted patents·3 pending applications·104 citations·filing 1991–2023
95Inventor score
Files withSAMSUNG ELECTRONICS CO LTD16AMERICAN MESSAGING SERVICES LLC7LG DISPLAY CO LTD2LG ELECTRONICS INC2UNIV GEORGETOWN2
Top patents by PatentIndex Score
35 records- 0194US9153631B2Organic light emitting diode display deviceLG DISPLAY CO LTD·Filed 2014·Granted Oct 6, 2015·17 cites·20 claims
- 0291US8756511B2Gesture based unlocking of a mobile terminalHEO JEONGYUN·Filed 2012·Granted Jun 17, 2014·22 cites·20 claims
- 0388US10361177B2Semiconductor package having a molding layer including a molding cavity and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 23, 2019·6 cites·20 claims
- 0485US11101243B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 24, 2021·4 cites·20 claims
- 0584US12309630B2Messaging devices and methodsAMERICAN MESSAGING SERVICES LLC·Filed 2023·Granted May 20, 2025·0 cites·12 claims
- 0681US10347859B2Organic light emitting deviceSAMSUNG DISPLAY CO LTD·Filed 2017·Granted Jul 9, 2019·1 cites·20 claims
- 0778US11107769B2Semiconductor package and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 31, 2021·1 cites·20 claims
- 0874US11996365B2Semiconductor package and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 28, 2024·0 cites·15 claims
- 0972US11838785B2Messaging devices and methodsAMERICAN MESSAGING SERVICES INC·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 1070US11610845B2Semiconductor package and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·19 claims
- 1168US11412402B2Messaging devices and methodsAMERICAN MESSAGING SERVICES LLC·Filed 2020·Granted Aug 9, 2022·0 cites·5 claims
- 1268US5240868AMethod of fabrication metal-electrode in semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1991·Granted Aug 31, 1993·44 cites·5 claims
- 1367US11469156B2Semiconductor package for discharging heat generated by semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 11, 2022·0 cites·13 claims
- 1466US2023343560A1Apparatus for conducting plasma surface treatment, board treatment system having the same, and method of manufacturing semiconductor devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1565US12438134B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 1665US11951167B2Targeted liposomesUNIV GEORGETOWN·Filed 2021·Granted Apr 9, 2024·0 cites·30 claims
- 1765US11742329B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 1863US10911734B2Display device for personal immersive deviceLG DISPLAY CO LTD·Filed 2016·Granted Feb 2, 2021·1 cites·16 claims
- 1963US9501214B2Mobile terminal and controlling method thereofLG ELECTRONICS INC·Filed 2014·Granted Nov 22, 2016·2 cites·18 claims
- 2062US10681581B2Messaging devices and methodsAMERICAN MESSAGING SERVICES LLC·Filed 2018·Granted Jun 9, 2020·0 cites·19 claims
- 2158US10051505B2Messaging devices and methodsAMERICAN MESSAGING SERVICES LLC·Filed 2017·Granted Aug 14, 2018·0 cites·20 claims
- 2258US2014120157A1Targeted liposomesUNIV GEORGETOWN·Filed 2013·Application pending·0 cites
- 2357US9743308B2Messaging devices and methodsAMERICAN MESSAGING SERVICES LLC·Filed 2017·Granted Aug 22, 2017·0 cites·20 claims
- 2456US10978374B2Semiconductor package for discharging heat generated by semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·7 claims
- 2555US11728142B2Apparatus for conducting plasma surface treatment, board treatment system having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 15, 2023·0 cites·20 claims
- 2655US11508713B2Methods of manufacturing semiconductor package and package-on-packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·20 claims
- 2755US8841989B2Messaging devices and methodsAMERICAN MESSAGING SERVICES LLC·Filed 2013·Granted Sep 23, 2014·0 cites·27 claims
- 2854US9608680B2Messaging devices and methodsAMERICAN MESSAGING SERVICES LLC·Filed 2014·Granted Mar 28, 2017·0 cites·17 claims
- 2951US11569209B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·0 cites·20 claims
- 3049US8648712B2Electronic emergency messaging systemPOTTLE J ROY·Filed 2010·Granted Feb 11, 2014·2 cites·75 claims
- 3147US12463122B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 3246US10964403B2Shift register unit, driving method, gate driving circuit and display deviceCHONGQING BOE OPTOELECTRONICS TECH CO LTD·Filed 2019·Granted Mar 30, 2021·0 cites·17 claims
- 3340US9967378B2Mobile terminalLG ELECTRONICS INC·Filed 2016·Granted May 8, 2018·0 cites·20 claims
- 3440US2011281252A1Methods and systems for reducing the number of textbooks used in educational settingsPANDYA SHEFALI A·Filed 2010·Application pending·0 cites
- 3526US5306668AMethod of fabricating metal-electrode in semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1993·Granted Apr 26, 1994·4 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →