Inventor · disambiguated record
Say-Teng Lai
Also filed as: LAI SAY-TENG
2 granted patents·12 citations·filing 1998–2001
55Inventor score
Technology areasH10W
Files withHEWLETT PACKARD CO2
Top patents by PatentIndex Score
2 records- 0142US6236015B1Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bondingHEWLETT PACKARD CO·Filed 1998·Granted May 22, 2001·11 cites·6 claims
- 0241US6476346B2Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bondingHEWLETT PACKARD CO·Filed 2001·Granted Nov 5, 2002·1 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Say-Teng Lai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →