Inventor · disambiguated record
Sang Ho Lee
Also filed as: LEE SANG C · LEE SANG H · LEE SANG HO · LEE SANG J
315 granted patents·163 pending applications·2,978 citations·filing 1985–2025
99Inventor score
Files withSAMSUNG ELECTRONICS CO LTD54LEE SANG HO32SK HYNIX INC20HYUNDAI MOTOR CO LTD19KOREA ELECTRONICS TELECOMM19
Top patents by PatentIndex Score
478 records- 0198USD527366SPhone-combined personal digital assistantLG ELECTRONICS INC·Filed 2005·Granted Aug 29, 2006·157 cites·1 claims
- 0298USD498736SPhone-combined PDALG ELECTRONICS INC·Filed 2004·Granted Nov 23, 2004·108 cites·1 claims
- 0397US11794590B2Apparatus for controlling motor of a vehicle and method thereofHYUNDAI MOTOR CO LTD·Filed 2021·Granted Oct 24, 2023·8 cites·18 claims
- 0497US11121134B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 14, 2021·7 cites·20 claims
- 0597USD523837SPhone-combined personal digital assistantLG ELECTRONICS INC·Filed 2005·Granted Jun 27, 2006·87 cites·1 claims
- 0697US6995459B2Semiconductor package with increased number of input and output pinsAMKOR TECHNOLOGY INC·Filed 2005·Granted Feb 7, 2006·129 cites·20 claims
- 0796US11594538B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 28, 2023·4 cites·20 claims
- 0896US10414285B2Apparatus and method for preventing over-charging of batteryHYUNDAI AUTRON CO LTD·Filed 2017·Granted Sep 17, 2019·23 cites·9 claims
- 0996USD526300SPhone-combined personal digital assistantLG ELECTRONICS INC·Filed 2005·Granted Aug 8, 2006·86 cites·1 claims
- 1095US6927483B1Semiconductor package exhibiting efficient lead placementAMKOR TECHNOLOGY INC·Filed 2003·Granted Aug 9, 2005·127 cites·24 claims
- 1195US6876068B1Semiconductor package with increased number of input and output pinsAMKOR TECHNOLOGY INC·Filed 2003·Granted Apr 5, 2005·108 cites·24 claims
- 1294US11132739B1Systems and methods for on-demand decomposition of orders and urgency-based identification of item combination for fulfillmentCOUPANG CORP·Filed 2020·Granted Sep 28, 2021·5 cites·20 claims
- 1394US10934621B2Gas injection module, substrate processing apparatus, and method of fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·14 cites·12 claims
- 1493US8159986B2Method for providing multicast broadcast service in communication systemYUN MI-YOUNG·Filed 2007·Granted Apr 17, 2012·23 cites·16 claims
- 1592US11718285B2Device and method for improving turning motion of vehicleHYUNDAI MOTOR CO LTD·Filed 2021·Granted Aug 8, 2023·2 cites·19 claims
- 1692US10738663B2Locking structure of valve timing adjustment apparatus for internal combustion engineHYUNDAI MOTOR CO LTD·Filed 2016·Granted Aug 11, 2020·5 cites·9 claims
- 1792US9685235B2Method of initializing 3D non-volatile memory deviceSK HYNIX INC·Filed 2016·Granted Jun 20, 2017·18 cites·30 claims
- 1892US7580728B2Universal mobile gaming docking station and controllerUSA WIRELESS SOLUTIONS·Filed 2005·Granted Aug 25, 2009·61 cites·17 claims
- 1992US6631266B1Method for calculating the coverage area according to the antenna patterns in a sector base stationSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Oct 7, 2003·163 cites·6 claims
- 2091US11143411B2Cooking applianceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 12, 2021·6 cites·18 claims
- 2191US9851753B2Electronic device and method for controlling power supply of electronic deviceLENOVO BEIJING CO LTD·Filed 2015·Granted Dec 26, 2017·19 cites·15 claims
- 2289US11379907B1Systems and computerized methods for item correlation and prioritizationCOUPANG CORP·Filed 2020·Granted Jul 5, 2022·2 cites·15 claims
- 2389US8273607B2Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereofPARK SOO-SAN·Filed 2010·Granted Sep 25, 2012·11 cites·16 claims
- 2489US8115293B2Integrated circuit packaging system with interconnect and method of manufacture thereofMOON DONGSOO·Filed 2009·Granted Feb 14, 2012·26 cites·20 claims
- 2589US7659609B2Integrated circuit package-in-package system with carrier interposerSTATS CHIPPAC LTD·Filed 2007·Granted Feb 9, 2010·19 cites·18 claims
- 2689US7185653B2Disposable mask for dust protectionINSAN CO LTD·Filed 2004·Granted Mar 6, 2007·60 cites·9 claims
- 2789US6483158B1Semiconductor memory device and fabrication method thereforHYUNDAI ELECTRONICS IND·Filed 2000·Granted Nov 19, 2002·43 cites·7 claims
- 2888US11733616B2System for supplying photoresist and method for fabricating semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 22, 2023·1 cites·18 claims
- 2988US10091272B2Method and apparatus for remotely controlling home device in home network systemSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 2, 2018·9 cites·23 claims
- 3088US7814237B2Dual mode mobile communication terminal and method for automatically recognizing card information and selecting a drive modeSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 12, 2010·16 cites·10 claims
- 3187US7863755B2Package-on-package system with via Z-interconnectionsSTATS CHIPPAC LTD·Filed 2008·Granted Jan 4, 2011·13 cites·17 claims
- 3287US7799267B2Method for manufacture of transparent ceramicsPENN STATE RES FOUND·Filed 2008·Granted Sep 21, 2010·26 cites·19 claims
- 3387US7456088B2Integrated circuit package system including stacked dieSTATS CHIPPAC LTD·Filed 2006·Granted Nov 25, 2008·13 cites·10 claims
- 3487US7412354B2Method for measuring quantity of usage of CPUPROTIMUS TECHNOLOGIES LLC·Filed 2006·Granted Aug 12, 2008·12 cites·7 claims
- 3587US6804630B2Method for measuring quantity of usage of CPULG ELECTRONICS INC·Filed 2001·Granted Oct 12, 2004·31 cites·29 claims
- 3687US6627030B2Variable lamination manufacturing (VLM) process and apparatusKOREA ADVANCED INST SCI & TECH·Filed 2001·Granted Sep 30, 2003·26 cites·6 claims
- 3787US5798240ARecombinant mycobacterial methionyl-tRNA synthetase genes and methods of use thereforeCUBIST PHARM INC·Filed 1996·Granted Aug 25, 1998·84 cites·62 claims
- 3887US5750531APyrimidine derivatives and processes for the preparation thereofYUHAN CORP·Filed 1995·Granted May 12, 1998·91 cites·13 claims
- 3986US8963614B2Semiconductor deviceSK HYNIX INC·Filed 2013·Granted Feb 24, 2015·7 cites·14 claims
- 4086US7652376B2Integrated circuit package system including stacked dieSTATS CHIPPAC LTD·Filed 2008·Granted Jan 26, 2010·11 cites·9 claims
- 4186US5851411AHigh-density liquid crystal display and methodLG ELECTRONICS INC·Filed 1996·Granted Dec 22, 1998·119 cites·26 claims
- 4285US9343117B1Semiconductor integrated circuit and method of driving the sameSK HYNIX INC·Filed 2015·Granted May 17, 2016·7 cites·18 claims
- 4385US8632909B2Sheath for enclosing a pouch of a secondary batteryLEE SANG-HO·Filed 2006·Granted Jan 21, 2014·5 cites·6 claims
- 4484US8761056B2System for providing EMBMS chatting service and service provider server of the same, and method for controlling eBM-SC and user equipmentHYUN EUN HEE·Filed 2011·Granted Jun 24, 2014·8 cites·20 claims
- 4584US8615929B2Door opening/closing device for ice dispenser in refrigeratorLEE SANG HO·Filed 2010·Granted Dec 31, 2013·14 cites·3 claims
- 4684US8239853B2Method of displaying attachment file list in mobile communication terminal, method of downloading and uploading attachment file using e-mail protocol, and mobile communication terminal for performing the sameLEE SANG HO·Filed 2007·Granted Aug 7, 2012·11 cites·11 claims
- 4784US7872340B2Integrated circuit package system employing an offset stacked configurationSTATS CHIPPAC LTD·Filed 2008·Granted Jan 18, 2011·10 cites·18 claims
- 4883US9754673B2Method of initializing and driving 3D non-volatile memory device using time varying erase signalSK HYNIX INC·Filed 2016·Granted Sep 5, 2017·7 cites·20 claims
- 4983USD666563SDigital set-top boxLEE SANG-HO·Filed 2011·Granted Sep 4, 2012·29 cites·1 claims
- 5083US7702937B2Method and apparatus for operating a computer system by adjusting a performance state of a processor resourceANPA INC·Filed 2006·Granted Apr 20, 2010·10 cites·21 claims
Showing the top 50 of 478 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →