Inventor · disambiguated record
Sang-Hyeop Lee
Also filed as: LEE SANG HYEOP
9 granted patents·10 pending applications·185 citations·filing 1997–2025
89Inventor score
Top patents by PatentIndex Score
19 records- 0190US6218260B1Methods of forming integrated circuit capacitors having improved electrode and dielectric layer characteristics and capacitors formed therebySAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Apr 17, 2001·76 cites·26 claims
- 0279US6573168B2Methods for forming conductive contact body for integrated circuits using dummy dielectric layerSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jun 3, 2003·28 cites·34 claims
- 0371US7148080B2Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 12, 2006·19 cites·45 claims
- 0469US6624069B2Methods of forming integrated circuit capacitors having doped HSG electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Sep 23, 2003·12 cites·46 claims
- 0559US2025214785A1End effector and substrate transfer apparatusSEMES CO LTD·Filed 2024·Application pending·0 cites
- 0657US6077573APlasma enhanced chemical vapor deposition methods of forming hemispherical grained silicon layersSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Jun 20, 2000·18 cites·30 claims
- 0757US5932923ASemiconductor device packages having dummy block leads and tie bars with extended portions to prevent formation of air traps in the encapsulateSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Aug 3, 1999·28 cites·16 claims
- 0857US2025364284A1Buffer chamber and substrate processing apparatus including the chamberSEMES CO LTD·Filed 2025·Application pending·0 cites
- 0955US2024139967A1Substrate transport robot and substrate processing system including the sameSEMES CO LTD·Filed 2023·Application pending·0 cites
- 1054US2024203774A1Apparatus for transferring substrateSEMES CO LTD·Filed 2023·Application pending·0 cites
- 1153US6876029B2Integrated circuit capacitors having doped HSG electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 5, 2005·4 cites·14 claims
- 1244US7988873B2Method of forming a mask pattern for fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 2, 2011·0 cites·16 claims
- 1344US2007007634A1Method for manufacturing semiconductor chip packageYOUN CHEUL-JOONG·Filed 2006·Application pending·0 cites
- 1440US7414303B2Lead on chip semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Aug 19, 2008·0 cites·19 claims
- 1539US2004158978A1Molding method and mold for encapsulating both sides of PCB module with wafer level package mounted PCBFiled 2004·Application pending·0 cites
- 1638US2005242417A1Semiconductor chip package and method for manufacturing the sameYOUN CHEUL-JOONG·Filed 2004·Application pending·0 cites
- 1736US2004178514A1Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the methodFiled 2003·Application pending·0 cites
- 1835US2012049386A1Semiconductor packageOH HYUNG-GEUN·Filed 2011·Application pending·0 cites
- 1935US2006151878A1Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip packageJEONG SE-YOUNG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →