Inventor · disambiguated record
Sang S. Lee
Also filed as: LEE SANG S · LEE SANG SEOP
21 granted patents·2 pending applications·977 citations·filing 1991–2016
96Inventor score
Files withVLSI TECHNOLOGY INC15HYUNDAI MOBIS CO LTD3BOAM R & D CO LTD2LEE SANG SEOP2DONGBU HITEK CO LTD1
Top patents by PatentIndex Score
23 records- 0197US5332864AIntegrated circuit package having an interposerVLSI TECHNOLOGY INC·Filed 1991·Granted Jul 26, 1994·302 cites·17 claims
- 0289US5379187ADesign for encapsulation of thermally enhanced integrated circuitsVLSI TECHNOLOGY INC·Filed 1993·Granted Jan 3, 1995·137 cites·8 claims
- 0388USD804393SConsole for automobileHYUNDAI MOBIS CO LTD·Filed 2016·Granted Dec 5, 2017·32 cites·1 claims
- 0483US5598031AElectrically and thermally enhanced package using a separate silicon substrateVLSI TECHNOLOGY INC·Filed 1994·Granted Jan 28, 1997·81 cites·40 claims
- 0583US5430331APlastic encapsulated integrated circuit package having an embedded thermal dissipatorVLSI TECHNOLOGY INC·Filed 1993·Granted Jul 4, 1995·80 cites·45 claims
- 0681US5441684AMethod of forming molded plastic packages with integrated heat sinksVLSI TECHNOLOGY INC·Filed 1993·Granted Aug 15, 1995·68 cites·23 claims
- 0776US5359227ALead frame assembly and method for wiring sameVLSI TECHNOLOGY INC·Filed 1993·Granted Oct 25, 1994·47 cites·14 claims
- 0875US5964030AMold flow regulating dam ringVLSI TECHNOLOGY INC·Filed 1998·Granted Oct 12, 1999·50 cites·16 claims
- 0972USD816567SSteering wheel for automobileHYUNDAI MOBIS CO LTD·Filed 2016·Granted May 1, 2018·14 cites·1 claims
- 1067US5625225AMulti-layered, integrated circuit package having reduced parasitic noise characteristicsVLSI TECHNOLOGY INC·Filed 1996·Granted Apr 29, 1997·37 cites·2 claims
- 1166US5839184AMethod for creating on-package inductors for use with integrated circuitsVLSI TECHNOLOGY INC·Filed 1997·Granted Nov 24, 1998·34 cites·6 claims
- 1258US5296744ALead frame assembly and method for wiring sameVLSI TECHNOLOGY INC·Filed 1992·Granted Mar 22, 1994·23 cites·4 claims
- 1356US5825623APackaging assemblies for encapsulated integrated circuit devicesVLSI TECHNOLOGY INC·Filed 1995·Granted Oct 20, 1998·23 cites·10 claims
- 1447US2009000649A1Method for cleaning waferLEE SANG-SEOP·Filed 2008·Application pending·0 cites
- 1546US5641988AMulti-layered, integrated circuit package having reduced parasitic noise characteristicsVLSI TECHNOLOGY INC·Filed 1995·Granted Jun 24, 1997·14 cites·9 claims
- 1645US7939410B2Semiconductor device and manufacturing method thereofDONGBU HITEK CO LTD·Filed 2008·Granted May 10, 2011·0 cites·12 claims
- 1745US2012145225A1Trench line for the disconnection of a solar cellLEE SANG SEOP·Filed 2010·Application pending·0 cites
- 1840US5924190AMethods and apparatus for manufacturing encapsulated integrated circuitsVLSI TECHNOLOGY INC·Filed 1998·Granted Jul 20, 1999·10 cites·8 claims
- 1939US5448825AMethod of making electrically and thermally enhanced integrated-circuit packageVLSI TECHNOLOGY INC·Filed 1994·Granted Sep 12, 1995·8 cites·10 claims
- 2038USD830093SHeadrest for automobile having speakersHYUNDAI MOBIS CO LTD·Filed 2016·Granted Oct 9, 2018·2 cites·1 claims
- 2137US5331511AElectrically and thermally enhanced integrated-circuit packageVLSI TECHNOLOGY INC·Filed 1993·Granted Jul 19, 1994·7 cites·12 claims
- 2233US5340422AMethod for making ferrite chip bead arrayBOAM R & D CO LTD·Filed 1993·Granted Aug 23, 1994·5 cites·5 claims
- 2332US5378297AFerrite chip bead and method for making sameBOAM R & D CO LTD·Filed 1993·Granted Jan 3, 1995·3 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →