Inventor · disambiguated record
Sa Yong Lee
Also filed as: LEE SA YONG
12 granted patents·19 pending applications·17 citations·filing 2008–2019
84Inventor score
Files withSAMSUNG ELECTRO MECH28JEON KEE SU1SAMSUNG ELECTRO MECHANICS LTD1UNIV NORTH CAROLINA STATE1
Top patents by PatentIndex Score
31 records- 0195US9899136B2Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 20, 2018·11 cites·29 claims
- 0282US10636562B2Coil electronic component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Apr 28, 2020·2 cites·20 claims
- 0380US11488768B2Coil componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 1, 2022·1 cites·8 claims
- 0473US10902994B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 26, 2021·1 cites·19 claims
- 0572US9035738B2Multilayer inductor and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted May 19, 2015·2 cites·21 claims
- 0658US11013114B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2019·Granted May 18, 2021·0 cites·20 claims
- 0758US2017148562A1Coil componentSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 0857US9288902B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Mar 15, 2016·0 cites·5 claims
- 0953US9236177B2Common mode filterSAMSUNG ELECTRO MECH·Filed 2013·Granted Jan 12, 2016·0 cites·5 claims
- 1052US2015097647A1Magnetic substrate and method of manufacturing the same, bonding structure between magnetic substrate and insulating material, and chip component having the bonding structureSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1152US2014080941A1Insulating composition for multilayer printed circuit board, method for preparing the same, and multilayer printed circuit board comprising the same as insulating layerSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1251US2015114696A1Core substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1351US2015114691A1Core substrate and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1450US11763982B2Inductor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2018·Granted Sep 19, 2023·0 cites·15 claims
- 1550US2014154479A1Resin composition for printed circuit board, insulating film, prepreg and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1650US2020090848A1Magnetic substrate and method of manufacturing the same, bonding structure between magnetic substrate and insulating material, and chip component having the bonding structureSAMSUNG ELECTRO MECH·Filed 2019·Application pending·0 cites
- 1748US11430737B2Flexible printed circuit board with embedded electronic elementSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 30, 2022·0 cites·21 claims
- 1848US2015053457A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECHANICS LTD·Filed 2014·Application pending·0 cites
- 1947US2015050504A1Core substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2046US2013337268A1Insulating epoxy resin composition, insulating film manufactured therefrom, and multilayer printed circuit board having the sameJEON KEE SU·Filed 2012·Application pending·0 cites
- 2146US2014080940A1Resin composition for insulation, insulating film, prepreg, and printed circuit board.SAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2246US2015104630A1Prepreg for printed circuit board, manufacturing method thereof, and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2346US2015060115A1Copper clad laminate for printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2445US2009178591A1Carbohydrate-gypsum compositeUNIV NORTH CAROLINA STATE·Filed 2008·Application pending·0 cites
- 2545US2020163228A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2019·Application pending·0 cites
- 2645US2014076198A1Epoxy resin composition for insulation, insulating film, prepreg, and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2744US2014127483A1Copper-clad laminate. method for manufacturing the same, and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2843US10847300B2Inductor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 24, 2020·0 cites·17 claims
- 2942US11476034B2Coil electronic componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 18, 2022·0 cites·15 claims
- 3042US2015027763A1Inorganic filler, and insulating resin composition, insulating film, prepreg and printed circuit board including the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3137US2017086290A1Prepreg, printed circuit board including prepreg, and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →